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Preparation process for anti-oxidation copper-based bonding wires

A preparation process and bonding wire technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of bonding wire packaging, high price of bonding gold wire and hardness of bonding copper wire, etc., to reduce impact force and Effects of destroying, reducing bonding energy, and improving hardness

Active Publication Date: 2013-03-27
广东佳博电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on the above reasons, the applicant provides a copper-based bonding wire for the above-mentioned gold bonding wire and copper bonding wire manufacturing technology and specific problems in practical applications, which solves the problems of high price of bonding gold wire, hardness of bonding copper wire, and Oxidation, bonding wire packaging, storage and transportation, etc.

Method used

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  • Preparation process for anti-oxidation copper-based bonding wires

Examples

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Embodiment 1

[0028] A copper-based bonding wire, the basic material is copper, and Pt, Ce, Pd trace metal elements are added to form a master alloy base material, and the surface of the metal wire made of the master alloy base material is plated with a layer of gold. Among them, the purity of copper and plated gold are higher than 99.99%.

[0029] The weight proportion of each metal component in the bonding wire material is: Cu is 94.9933%, trace metal element Pt is 0.0007%, Ce is 0.002%, Pd is 0.004%, plated gold is 5%, and the diameter of the bonding wire is 50 microns , the gold layer thickness is 0.6 μm.

[0030] The preparation of copper-based bonding wire includes the following steps:

[0031] The first step is to mix the metal substrate. Cu with a purity higher than 99.99% is mixed with selected trace metal materials Pt, Ce, and Pd to form the base alloy of the master alloy, and the preliminary preparation for mixed smelting is done.

[0032] Step 2, smelting the mother alloy bla...

Embodiment 2

[0040]A copper-based bonding wire, the basic material is copper, and Pt, Ce, Pd trace metal elements are added to form a master alloy base material, and the surface of the metal wire made of the master alloy base material is plated with a layer of gold. Among them, the purity of copper and plated gold are higher than 99.99%.

[0041] The mass proportion of each metal component in the bonding wire material is: Cu is 95.9923%, trace metal element Pt is 0.0007%, Ce is 0.004%, Pd is 0.003%, gold plating is 4% gold, and the diameter of the bonding wire is 50% microns, with a gold layer thickness of 0.5 microns.

[0042] The preparation process of the copper-based bonding wire includes the following steps:

[0043] The first step is to mix the metal substrate. Cu with a purity higher than 99.99% is mixed with selected trace metal materials Pt, Ce, and Pd to form the base alloy of the master alloy, and the preliminary preparation for mixed smelting is done.

[0044] Step 2, smelti...

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Abstract

The invention provides anti-oxidation copper-based bonding wires, which comprise copper serving as a base material, wherein trace metal elements such as Pt, Ce and Pd are added into the copper to form a master alloy base material; the master alloy base material is made into thin wires, and a gold layer is plated on the surfaces of the thin wires to form the bonding wires; and the purities of the copper and gold are more than 99.99 percent. The invention also provides a preparation process for the bonding wires. The preparation process comprises the steps of master alloy melting, drawing, cleaning, gold plating, annealing, winding, packaging and the like. The copper-based bonding wires have the advantages of copper bonding wires and gold bonding wires, have the characteristics of high oxidation resistance and electrical conductivity and low arc stability, have higher hardness compared with a single copper material, and have the advantages of low price and the like; moreover, the copper-based bonding wires are simple and convenient to package, can be stored for a long time at normal temperature, and can meet the requirement on electronic packaging high-end development.

Description

technical field [0001] The invention relates to a bonding wire manufacturing technology, in particular to a preparation technology for a copper-based master alloy bonding wire. Background technique [0002] Bonding Wires is a key material that needs to be used in the semiconductor packaging process of integrated circuits. The rapid development of the electronics industry has promoted the rapid development of bonding wire manufacturing technology. Bonding wire is a high tensile strength metal wire with a fine diameter, which is widely used in the package inner lead of integrated circuits, semiconductor discrete devices and LED light-emitting tubes. At present, in the application technology of bonding wire, alloy bonding wire, copper bonding wire, aluminum bonding wire, gold bonding wire, etc. are widely used. The most common are bonding wire, aluminum bonding wire and copper bonding wire. several. [0003] Bonding wire is mostly high-purity gold fine wire with a diameter of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/49
CPCH01L2924/01327C22C9/00H01L2224/45124H01L24/45H01L24/43H01L2224/45644H01L2224/45144H01L2224/43H01L2224/45565H01L2224/45147H01L2224/43848H01L2224/45H01L2224/45015H01L2924/00011H01L2924/00014H01L2924/14H01L2924/01204H01L2924/01057H01L2924/01058H01L2924/01046H01L2924/00015H01L2924/00H01L2924/013H01L2224/48H01L2924/2011H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/20756H01L2924/20757H01L2924/01006H01L2924/00012H01L2924/01078
Inventor 赵碎孟周钢薛子夜
Owner 广东佳博电子科技有限公司
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