Mainboard signal testing device
A signal test and main board technology, applied in error detection/correction, instrumentation, electrical digital data processing, etc., can solve the problems of difficult oscilloscope probe point measurement, high operation difficulty, short circuit, etc., and achieve simple structure, convenient operation, The effect of high measurement accuracy
Inactive Publication Date: 2012-02-01
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
[0003] Since most of the DRAM (Dynamic Random Access Memory, DRAM) chips on the current DDR3 memory are packaged in a fine-pitch ball grid array (FBGA), the solder joints are completely covered, so it is difficult to directly use the oscilloscope Probes are used for spot testing, but extension wires can only be soldered to the test points on the back of the memory, and then connected to the probes for measurement
However, the extension wire itself is easy to affect the accuracy of the detection signal, and it is difficult to weld the extension wire on dense test points, and it is easy to cause a short circuit
Method used
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[0034] The invention provides a motherboard signal testing device, which is used for simulating the function of a memory bar of a computer to test the signal transmission quality of the DDR bus of the computer motherboard.
[0035] see figure 1 , a preferred embodiment of the present invention provides a motherboard signal testing device 100, which includes a printed circuit board (printed circuit board, PCB) 10, a connection module 20, a verification module 30 and a plurality of signal acquisition units 40, the connection The module 20 , the verification module 30 and the signal acquisition unit 40 are all integrated on the printed circuit board 10 .
[0036] Described connection module 20 is electrically connected with printed circuit board 10, and it comprises several connection terminals, when this motherboard signal testing device 100 inserts the DDR dual inline memory module slot (Dual Inline Memory Modules, DIMM) of computer motherboard to be tested ), the connecting t...
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The invention provides a mainboard signal testing device, which is used for testing the signal quality of a double-data-rate bus of a computer mainboard. The mainboard signal testing device comprises a circuit board, and a connecting module, a verifying module and a signal acquisition unit which are arranged on the circuit board, wherein the connecting module comprises a plurality of connecting terminals; both the verifying module and the signal acquisition module are electrically connected with the computer mainboard through the connecting terminals; information of the double-data-rate bus is preset in the verifying module, so that the computer mainboard can be used for identifying the mainboard signal testing device; the signal acquisition unit comprises a plurality of signal acquisition modules; each signal acquisition module is provided with a signal testing point; and the signal testing points are used for acquiring a signal of the double-data-rate bus. The mainboard signal testing device is convenient for testing, and has high measuring accuracy.
Description
technical field [0001] The invention relates to a main board signal testing device, in particular to a testing device for testing the double data rate bus signal of the main board. Background technique [0002] With the rapid development of computer technology, the commonly used type of double data rate (Double Data Rate, DDR) bus has also developed from DDR266 type to the current DDR3 / 1333 type, and its data transmission speed has been increased by about 5 times. However, with the increase of bus signal transmission speed, various interference factors, such as impedance changes, adjacent signal crosstalk, electromagnetic interference (ElectroMagnetic Interference, EMI), etc., have more obvious effects on bus signal transmission, so it is necessary to DDR3 / 1333 type bus for performance testing. [0003] Since most of the DRAM (Dynamic Random Access Memory, DRAM) chips on the current DDR3 memory are packaged in a fine-pitch ball grid array (FBGA), the solder joints are compl...
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IPC IPC(8): G06F11/267
CPCG06F11/221
Inventor 许李卫明
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD