Capping shutter control method in scanning laser processing of film board
A laser processing and scanning technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as damage to precision parts and high intensity of laser beams
Inactive Publication Date: 2014-08-06
TSINGHUA UNIV
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Problems solved by technology
Due to the high precision of moving parts such as wafer stages processed by semiconductor lasers, and the high intensity of the laser beam, if things go on like this, the stronger laser beam is likely to cause damage to precision parts
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[0023] The invention provides a control method of a light-shielding shutter in the scanning laser processing of a film stage. The light-shielding shutter is opened and closed during the operation of the stage, and the timing of opening and closing is as follows: figure 1 shown. Before the film stage starts to run, in the standby stage, usually, the laser source can be turned on, but the light-shielding shutter is always closed, so as to provide the greatest safety guarantee for other key parts of the equipment, for the operator or equipment engineer, etc. ; The laser beam irradiation position 2 where the light-shielding shutter is in the opening stage; at this time, the film stage and other key parts of the equipment are not irradiated by strong laser light, and are in a protected state. When laser processing is started, the wafer stage carries the wafer 1 to be processed, press figure 1 Make a serpentine scanning movement as indicated by the middle arrow line. After the las...
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The invention discloses a capping shutter control method in scanning laser processing of a film board. The method comprises the following steps that: during an operation process of a film board, opening and closing of a capping shutter is controlled by a control system of a laser processing system; at a standby phase before the film board is started to work, a laser source is opened or closed; but the capping shutter is always closed, so that equipment and operating personnel are protected; when the laser processing is started, the control system controls the capping shutter to be opened; the film board carrying a wafer that is to be processed makes serpentine scanning motions; after a laser beam scans the whole wafer and the scanned wafer is moved out, the capping shutter is closed timely; and at the opening / closing phases of the capping shutter, the laser beam only partially irradiates a certain position of the film board; meanwhile, because the film board is in a moving state, an occurrence of a phenomenon that the strong laser irradiates a fixed position on the film board is avoided. Therefore, damage on the film board can be reduced to a minimum.
Description
technical field [0001] The invention belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a light-shielding shutter control method in the scanning laser processing of a wafer. Background technique [0002] Laser is used in the processing and manufacturing of semiconductor materials. According to the power intensity of the laser source used, it can be roughly divided into two situations. One is represented by excimer laser lithography exposure. The laser effect used has a low power density. The other is represented by laser scribing and slicing, which has a very strong local effect on the wafer and a high power density. [0003] On the other hand, since laser processing is a beamline processing technology, the cross-sectional area of the beamline cannot cover the area of the entire wafer under the existing technical conditions. At present, the diameter of wafers used in mainstream integrated circuit manufacturing is 300 mm...
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IPC IPC(8): H01L21/268B23K26/70
Inventor 严利人周卫刘朋窦维治
Owner TSINGHUA UNIV