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An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member

A technology for circuit connection and manufacturing method, applied in the field of adhesive films for circuit connection, can solve problems such as stretching of semiconductor elements, and achieve the effects of suppressing deformation, excellent connection reliability, and excellent film formability

Active Publication Date: 2014-12-31
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the case of connecting the glass substrate and the semiconductor element using an adhesive film, when the adhesive film is heated, it is heated by heat conduction and thermal expansion occurs, so the semiconductor element may be stretched.
Therefore, when the entire body is cooled after heating, the stretched semiconductor element may shrink, and deformation such as warpage may occur on the glass substrate constituting the FPD due to the shrinkage.

Method used

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  • An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
  • An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
  • An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138]

[0139]Using a coating device (manufactured by Yasui Seiki Co., Ltd., product name: Precision Coater), the coating solution A1 was coated on one side (the surface on which the coating solution was applied) and subjected to a release treatment (middle peeling treatment) on a PET film with a thickness of 50 μm, and dried with hot air at 70° C. for 10 minutes to form a conductive adhesive layer with a thickness of 10 μm on the PET film.

[0140]

[0141] In the same manner as above, using a coating device (manufactured by Yasui Seiki Co., Ltd., product name: Precision Coater), the coating solution B1 was coated on one side of a PET with a thickness of 50 μm that had been subjected to mold release treatment. film, and dried with hot air at 70° C. for 10 minutes to form an insulating adhesive layer with a thickness of 15 μm on the PET film.

[0142]

[0143] The conductive adhesive layer and insulating adhesive layer obtained above were laminated|stacked with the roll...

Embodiment 2～5 and comparative example 1～3

[0145] Except that the types of coating liquids (A1, A2, B1, B2) and the thicknesses (Tc, Ti) of the adhesive layer are shown in Table 3, the same procedure as in Example 1 was carried out to produce an adhesive for circuit connection. membrane.

[0146] table 3

[0147]

[0148] (2) Fabrication of circuit connection structure

[0149]

[0150] As a substrate, a glass substrate (Corning #1737, 38 mm x 28 mm, thickness 0.3 mm) with an ITO (Indium Tin Oxide) circuit pattern (pattern width 50 μm, inter-electrode spacing 5 μm) formed on the surface was prepared. As a semiconductor element, an IC chip (17 mm x 17 mm in outer shape, 0.3 mm in thickness, 50 μm x 50 μm in bump size, 50 μm in interval between bumps, and 15 μm in bump height) was prepared.

[0151]

[0152] Using the adhesive film for circuit connection produced in the said Example and the comparative example, the connection of an IC chip and a glass substrate was performed as follows. In addition, for connect...

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Abstract

PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection that is capable of maintaining an excellent connection reliability and suppressing deformation of a glass substrate even when used for connecting a glass substrate having a thickness thinner than that of a conventional circuit substrate with a semiconductor element, and that has an excellent film forming property.SOLUTION: A adhesive film for circuit connection 10 has: a conductive adhesive layer 3b containing an adhesive composition 4b and conductive particles 5; and an insulation adhesive layer 3a containing an adhesive composition 4a and not containing the conductive particles. A thickness Ti of the insulation adhesive layer 3a and a thickness Tc of the conductive adhesive layer 3b satisfy the relation of the following formula (1): Ti / Tc≥1.5...(1)

Description

technical field [0001] The present invention relates to an adhesive film for circuit connection, its use, a circuit connection structure, its manufacturing method, and a method for connecting circuit components. Background technique [0002] Conventionally, in order to connect a semiconductor element and a substrate, especially a glass substrate for a flat panel display (FPD) such as a liquid crystal, a thermosetting adhesive film cured by heating has been used. [0003] As a thermosetting adhesive film, materials containing epoxy resin as a thermosetting resin are widely used. When epoxy resin is cured by heating, it forms a polymer with high mechanical strength. Therefore, semiconductor elements and liquid crystal displays are bonded by this method. A strong connection can be obtained by using an agent film, and a highly reliable electrical device can be obtained. In recent years, the use of adhesive films containing acrylates that can be cured at lower temperatures than ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J9/02C09J171/12C09J163/00H05K3/32
CPCH01L2924/07811H01L2224/73204H01L2224/16225H01L2224/83101H01L2224/32225H01L24/29H01L24/83H01L2924/15788H01L2924/00C09J7/22C09J7/35C09J9/02C09J163/00C09J2203/00H01L21/67005
Inventor 杜晓黎佐藤和也
Owner RESONAC CORPORATION