High-reliability chip scale packaging method
A chip-level packaging and reliable technology, applied in the formation of wafer-level chip-scale packaging and the metal layer under solder bumps, can solve the problems of short-circuiting of solder bumps, easy dripping between solders, affecting soldering quality, etc. Adhesion, good wetting effect, effect of improving forming quality
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[0029] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] figure 2 It is a flow chart of a specific embodiment of the present invention to form solder bumps, including steps:
[0031] S101, sequentially forming a heat-resistant metal layer and a metal wetting layer on the chip pad and the passivation layer;
[0032] S102, forming a photoresist on the metal wetting layer, the photoresist is provided with an opening to expose the metal wetting layer above the chip pad;
[0033] S103, sequentially forming a barrier layer and a solder protection layer on the metal wetting layer in the opening;
[0034] S104, removing the photoresist;
[0035] S105, etching the heat-resistant metal layer and the metal wetting layer on the passivation layer until the passivation layer is exposed;
[0036] S106, forming a protective glue layer on the chip, the protective glue covering the solder protective l...
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