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High-strength tin cadmium lead-free solder alloy and preparation method thereof

A lead-free solder alloy, high-strength technology, used in welding equipment, metal processing equipment, welding/cutting media/materials, etc., to achieve good welding performance, simple preparation process, and ensure uniform distribution.

Inactive Publication Date: 2012-06-20
NANJING UNIV OF INFORMATION SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The melting point of the alloy is high, and the tensile strength of the alloy is not high enough
Therefore, the scope of use of the alloy is limited

Method used

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  • High-strength tin cadmium lead-free solder alloy and preparation method thereof
  • High-strength tin cadmium lead-free solder alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation method of the high-strength tin-cadmium series lead-free solder alloy of the present invention:

[0022] Firstly, according to the alloy composition of 20wt% of Cd, 0.01wt% of Bi, 0.01wt% of Sb, 0.01wt% of Sr, 0.01wt% of La, and the balance is Sn. The purity of raw materials Cd, Bi, Sb, Sr, La, and Sn is greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 460°C to obtain a master alloy, which is then placed in a heavy vacuum induction furnace. Carry out remelting in a melting tube crucible, the remelting temperature is 390°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible for melting After the alloy is melted, under the action of argon, it is sprayed from the hole with a diameter of 1mm at the bottom of the crucible and contacts the edge of the rotating runner to form an al...

Embodiment 2

[0024] The preparation method of high-strength tin-cadmium series lead-free solder alloy:

[0025] First according to Cd is 40wt%, Bi is 0.03wt%, Sb is 0.03wt%, Sr is 0.03wt%, La is 0.03wt%, and the balance is the alloy composition of Sn to carry out batching, raw material Cd, Bi, Sb, Sr, The purity of La and Sn are both greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 460°C to obtain a master alloy, which is then remelted in a remelting tubular crucible in a vacuum induction quenching furnace. The remelting temperature is 390°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible to melt, and the alloy is melted under the action of argon Spray from the hole with a diameter of 1mm at the bottom of the crucible and contact the edge of the rotating runner to form an alloy strip with a thickness of 25...

Embodiment 3

[0027] The preparation method of high-strength tin-cadmium series lead-free solder alloy:

[0028] First according to Cd is 30wt%, Bi is 0.02wt%, Sb is 0.02wt%, Sr is 0.02wt%, La is 0.02wt%, the balance is the alloy composition of Sn to carry out batching, raw material Cd, Bi, Sb, Sr, The purity of La and Sn is greater than 99.9%. The raw materials are melted in a vacuum induction furnace at a melting temperature of 470°C to obtain a master alloy, which is then remelted in a remelting tubular crucible in a vacuum induction quenching furnace. The remelting temperature is 400°C, the bottom of the remelting tubular crucible is placed 2-4mm above the rim of the runner of the quenching furnace, and the above master alloy is placed in the tubular crucible to melt, and the alloy is melted under the action of argon Spray from a hole with a diameter of 1mm at the bottom of the crucible and contact the edge of the rotating runner to form an alloy strip with a thickness of 250-350 micron...

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Abstract

The invention provides a high-strength tin cadmium lead-free solder alloy and a preparation method thereof. The alloy material has a low melting point, high spreadability, and high tensile strength, so the alloy has good weldability. The preparation method has a simple process and a low production cost, and is suitable for industrial production. The high-strength tin cadmium lead-free solder alloy is characterized by comprising the following components: 20-40wt% of Cd, 0.01-0.03wt% of Bi, 0.01- 0.03wt% of Sb, 0.01-0.03wt% of Sr, 0.01- 0.03wt% of La, and the balance being Sn.

Description

Technical field: [0001] The invention belongs to the field of metal materials, and relates to a high-strength tin-cadmium lead-free solder alloy and a preparation method thereof. Background technique: [0002] The invention No. CN200810226519.6 relates to a low-cost lead-free solder, in particular to a low-cost tin-zinc-bismuth-copper lead-free solder and its formed solder joints (or welds), which belong to the field of brazing material technology and application. The composition and mass percentage of the solder of the present invention are: Zn: 6.0-10.0%, Bi: 1.0-3.0%, Cu: 0.5-1.0%, and the balance is Sn. Compared with Sn-Pb solder and traditional Sn-Zn solder, the invention provides a non-polluting and easy-to-solder lead-free solder alloy. The first advantage of the solder is that its melting point is 185-200°C and its tensile strength is 92-94Mpa. Spreading area 51-59 (Cu:mm2 / 0.2g). The melting point of the alloy is high, and the tensile strength of the alloy is no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/02C22C13/00B22D11/06
Inventor 王玲赵浩峰陈文兵范乐王倩项青霞许根俊
Owner NANJING UNIV OF INFORMATION SCI & TECH
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