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Copper-based bonding wire and preparation method thereof

A bonding wire and copper-based technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as easy oxidation of bonding copper wires, low bonding production efficiency, and increased number of wire changes. Competitiveness, convenient transportation, effect of improving bonding strength

Inactive Publication Date: 2012-06-20
广东佳博电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 2. Bonding copper wire is easy to oxidize, and the conditions are limited during storage
Traditional copper wires are vacuum-packed, but with a large amount of packaging, there will be occasional individual leaks, and the transportation and handling process is also a factor that causes leaks
Once the package leaks, if it is not used for a short period of time, the copper wire will fail due to oxidation
At the same time, when used on the equipment, the copper wire has already begun to oxidize, and the length of the single axis can only use the copper wire with a maximum length of 200m. If it exceeds 200m, the latter part of the copper wire will fail due to oxidation.
Because the wire is short, the number of wire changes is increased, resulting in low bonding production efficiency

Method used

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  • Copper-based bonding wire and preparation method thereof
  • Copper-based bonding wire and preparation method thereof

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Embodiment 1

[0038] A copper-based bonding wire is a composite material composed of copper wire and a gold layer wrapped on the surface of the copper wire. In the material, copper is the base material, and its purity is higher than 99.99%. The mass ratio of gold is 2%. The purity is higher than 99.99%.

[0039] The diameter of the bonding wire is 50 microns, and the thickness of the gold-plated layer is 0.25 microns.

[0040] The preparation process of copper-based bonding wire is as follows:

[0041] Step 1, prefabricating copper rod blanks. The copper material with a purity of more than 99.99% is melted at a high temperature in a furnace with a vacuum degree of 0.001Mpa, the melting temperature is kept at 1100°C, and the refining time is 55 minutes. During the melting process, high-purity argon is used to protect it, and finally it is prepared by solidification. The diameter is 8 mm copper rod stock;

[0042] Step 2, prefabricating thin copper wires. The above-mentioned copper rod bl...

Embodiment 2

[0056] A copper-based bonding wire is a composite material composed of copper wire and a gold layer wrapped on the surface of the copper wire. In the material, copper is the base material, and its purity is higher than 99.99%. The mass ratio of gold is 5%. The purity is higher than 99.99%.

[0057] The diameter of the bonding wire is 50 microns, and the thickness of the gold-plated layer is 0.6 microns.

[0058] The copper-based bonding wire preparation process is:

[0059] Step 1, prefabricating copper rod blanks. The copper material with a purity of more than 99.99% is melted at a high temperature in a furnace with a vacuum degree of 0.008Mpa, the melting temperature is kept at 1100°C, and the refining time is 60 minutes. During the melting process, high-purity argon is used to protect it, and finally it is prepared by solidification. The diameter is 8 mm copper rod stock;

[0060] Step 2, prefabricating thin copper wires. The above-mentioned copper rod blank with a diam...

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Abstract

The invention provides a copper-based bonding wire and a preparation method thereof. The bonding wire is made of a copper wire and a composite material of which the surface is gilded, wherein the weight percent of gold in the bonding wire is 2 to 10 percent, and the purity of the gold is higher than 99.99 percent. The preparation method of the bonding wire mainly comprises the steps of melting, drawing, cleaning, gilding, annealing, winding, packaging and the like. The copper-based bonding wire has the advantages of high oxidation resistance, high electrical conductivity, low radian, low hardness and low price, and the copper wire is packaged by using a common material and can be stored for a long time at normal temperature and normal pressure, so that the copper-based wire can meet the development requirement for low cost, high performance and multiple functions and the like of electronic packaging.

Description

technical field [0001] The invention relates to a bonding wire preparation technology, in particular to an oxidation-resistant copper-based bonding wire and a preparation method thereof. Background technique [0002] The production of integrated circuits in the electronics industry requires the use of a basic material, the material for semiconductor packaging - Bonding Wires. Bonding wire is a fine-diameter high-tensile-strength metal wire, which is an essential package inner lead in the manufacturing process of integrated circuits, semiconductor discrete devices and LED light-emitting tubes. Electronic packaging is developing in the direction of high performance, multi-function, miniaturization, and portability. This development trend has continuously improved the performance requirements of integrated circuits, and has higher requirements for electronic packaging density. The specific performance is: the introduction of packaging The number of pins is increasing, the wiri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22F1/08C25D3/48C25D7/06
CPCH01L24/45H01L24/43H01L2224/45644H01L2224/43H01L2224/45565H01L2224/45147H01L2224/43848H01L2224/45H01L2224/45015H01L2224/45144H01L2924/00011H01L2924/00014H01L2924/14H01L2924/01204H01L2924/00H01L2224/48H01L2924/01079H01L2924/013H01L2924/00013H01L2924/2011H01L2924/01006H01L2924/00012
Inventor 赵碎孟周钢薛子夜
Owner 广东佳博电子科技有限公司
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