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Atmospheric pressure glow plasma enhanced atom layer deposition device

A technology of atomic layer deposition and plasma, which is applied in the field of plasma technology and atomic layer deposition equipment, can solve problems such as difficult large-area discharge, achieve the effect of reducing costs, avoiding damage, and realizing continuous online mass production

Inactive Publication Date: 2012-07-04
JIAXING KEMIN ELECTRONICS EQUIP TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because plasma, especially glow discharge plasma, is difficult to achieve large-area discharge under atmospheric pressure, there is no report on glow plasma enhanced atomic layer deposition equipment under atmospheric pressure.

Method used

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  • Atmospheric pressure glow plasma enhanced atom layer deposition device
  • Atmospheric pressure glow plasma enhanced atom layer deposition device

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with specific examples, but the present invention is not limited to these specific implementations. Those skilled in the art will realize that the present invention covers all alternatives, modifications and equivalents as may be included within the scope of the claims.

[0025] refer to figure 1 , an atmospheric pressure glow plasma enhanced atomic layer deposition device, including a relatively closed reaction chamber, the reaction chamber includes a main chamber 8, the main chamber 8 is provided with a precursor source inlet pipe port 11. The upper electrode 9 of the plasma generator and the lower electrode 10 of the plasma generator are directly opposite to each other. The sample 13 is placed on the lower electrode 10 of the plasma generator, and a heater 12 is arranged under the lower electrode 10 of the plasma generator. An air flow passage 14 is formed between the upper electrode 9 of the plasm...

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PUM

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Abstract

The invention discloses an atmospheric pressure glow plasma enhanced atom layer deposition device, which comprises a main chamber, wherein a precursor body source air inlet pipeline opening, an upper electrode of a plasma generator and a lower electrode of the plasma generator are arranged inside the main chamber; a heater is arranged below the lower electrode of the plasma generator; an airstream channel is formed between the upper electrode of the plasma generator and the lower electrode of the plasma generator; an outlet of the precursor body source air inlet pipeline opening is opposite to the airstream channel and an inlet of the precursor body source air inlet pipeline opening is connected with a source air inlet heating pipeline; the source air inlet heating pipeline is connected with a carrier gas cylinder; a precursor body source bottle is connected to the source air inlet heating pipeline; both the upper electrode of the plasma generator and the lower electrode of the plasma generator are connected with a radio frequency power supply; a plurality of ventilating holes for introducing the plasma discharge gas are arranged on the upper electrode of the plasma generator; all the ventilating holes are connected with a plasma discharge gas bottle; both the heater and the radio frequency power supply are connected to a PLC (programmable logic controller) and the PLC is connected with a computer.

Description

technical field [0001] The invention relates to low-temperature plasma technology and atomic layer deposition equipment, in particular to an atmospheric pressure glow plasma enhanced atomic layer deposition device. Background technique [0002] Atomic layer deposition is to alternately introduce gas-phase precursors on the substrate in a heating reactor, and perform self-limited growth of ultra-thin films through alternate surface saturation reactions. Atomic layer deposition technology has many advantages such as good bonding strength, layer-by-layer deposition, consistent film thickness, and good composition uniformity. Dielectric layer, flat panel display, integrated circuit interconnection diffusion barrier layer, interconnection barrier layer, interconnection copper electroplating deposition seed layer, nanomaterials, optical thin films, etc. Plasma-enhanced atomic layer deposition (PEALD) introduces plasma during the process of introducing reducing (oxidizing) gas to ...

Claims

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Application Information

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IPC IPC(8): C23C16/50
Inventor 万军饶志鹏黄成强陈波李超波夏洋江莹冰陶晓俊
Owner JIAXING KEMIN ELECTRONICS EQUIP TECH
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