Multi-station sapphire single-wire swinging cutting machine

Abstract

The invention relates to a multi-station sapphire single-wire swinging cutting machine, which belongs to the technical field of special sapphire cutting equipment. The multi-station sapphire single-wire swinging cutting machine cuts sapphire crystal and other super-hard materials by the aid of a diamond wire. The multi-station sapphire single-wire swinging cutting machine mainly comprises a framework, a plurality of workpiece carrying fixtures, a pay-off barrel spindle, a pay-off servo motor, a take-up barrel spindle, a take-up servo motor, a pay-off aluminum spool, a left tension servo motor, working table lifting servo motors, a cutting fixing plate, a swinging cutting arm and a take-up aluminum spool, wherein the workpiece carrying fixtures are arranged in the middle of the framework, and a sapphire workpiece is clamped on each workpiece carrying fixture. Preferably, the quantity of the workpiece carrying fixtures ranges from 2 to 5, and operation can be inconvenient when too many workpiece carrying fixtures are mounted on the framework. The multi-station sapphire single-wire swinging cutting machine is simple, compact and reasonable in structure, a scheme including that multiple working tables are simultaneously used for cutting is adopted, cutting wire consumption can be reduced, and cutting cost is lowered. In addition, the cutting speed of each working table can be individually controlled, cutting yield is greatly increased, and the multi-station sapphire single-wire swinging cutting machine has cutting capacity equivalent to cutting capacities of multiple machines.

Description

technical field [0001] The invention relates to a multi-station sapphire single-wire swing cutting machine, in particular cutting sapphire crystals and other superhard materials through diamond wires, and belongs to the technical field of sapphire special cutting equipment. Background technique [0002] The Mohs hardness of sapphire single crystal is 9, and its hardness is second only to diamond, so for a long time, it has been mostly cut with a circular saw blade coated with diamond particles. In order to obtain a better surface quality, the sapphire single crystal is also cut with an internal circular blade coated with diamond particles and a wire saw. Simultaneously, the thinnest thickness of the circular saw blade is also more than 1 mm, and the waste of sapphire single crystal material is serious during processing. The kerf of diamond wire saw is only 0.2-0.4mm, so the use of diamond wire saw can reduce the waste of raw materials. [0003] At present, with the vigorou...

AI Technical Summary

Problems solved by technology

[0005] The domestic use of single-wire saws in European and American countries is not very ideal, mainly reflected in the fact that the diameter of the take-up and pay-off reels is too small, causing the diamond wires to squeeze each other during high-speed reciprocating motion, causing the diamond particles to fall off and the cutting ability to decline.

A large part of the diamond particles are extruded and fall off by themselves without cutting effect, which cannot reach the cutting ability claimed by the diamond wire manufacturer, which greatly increases the amount of cutting wire used and the cutting cost remains high.

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