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Base board combination with conducting film layer and manufacture method thereof

A technology of conductive film layer and manufacturing method, which is applied in the field of substrate assembly with conductive film layer and its manufacturing, and can solve the problems of reducing the degree of conductivity of the conductive film layer

Active Publication Date: 2012-07-11
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned conductive ink modification method is mainly to add polymer materials to the conductive ink, and use the polymer materials to improve the adhesion between the conductive film layer and the substrate after sintering (Sinter). However, the polymer materials in the ink will Reduce the conductivity of the conductive film layer; and the method of substrate modification is mainly to form an adhesive layer such as oxide on the surface of the substrate to increase the adhesion of the substrate surface. , with no additional

Method used

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  • Base board combination with conducting film layer and manufacture method thereof
  • Base board combination with conducting film layer and manufacture method thereof
  • Base board combination with conducting film layer and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0033] A mixture of 55wt% acrylic resin and 45wt% methyl ethyl ketone (MEK for short) containing 1wt% multi-walled carbon nanotubes (Mingxin Technology, CN104Q carbon nanotubes) was coated on a thickness of 150 μm, and the glass transition The temperature is 80°C, and the insulation surface resistance is 1.82x10 13 On the polyethylene terephthalate (PET) substrate of Ω / sq, after using UV light curing, a surface treatment layer is formed, and its insulating surface resistance is greater than 10 14 Ω / sq.

[0034] Next, 50wt% organic acid silver (C 7 h 15 COOAg) is dissolved in 50wt% xylene to form a uniformly mixed silver metal conductive ink, which is coated on the surface treatment layer through a spin-coating process, using a background temperature of 150 ° C, supplemented by far-infrared light irradiation, for metal conduction The sintering of the ink forms the conductive film layers of Examples 1-4.

[0035] Utilize one hundred grid (Cross-Cut Method) test (ASTM D3330),...

Embodiment 5-8

[0044] Coating a mixture of polyacrylic acid and N-methylpyrrolidone solvent containing 1wt% multi-walled carbon nanotubes (Mingxin Technology, CN104Q carbon nanotubes) to a thickness of 150 μm, the glass transition temperature is 160 ° C, and the insulation resistance is greater than 10 14 On the polyacrylic (U-Polymer) substrate of Ω / sq, the surface treatment layer is formed after curing with UV light, and its insulation resistance is 9.95X10 10 Ω / sq.

[0045] 50wt% silver organic acid (C 7 h 15 COOAg) was dissolved in 50wt% xylene to obtain a uniformly mixed silver metal ink, which was coated on the above-mentioned surface treatment layer through a spin-coating process, using a background temperature of 150°C and supplemented by far-infrared light irradiation for metal conductive ink sintering to form the conductive film layer of embodiment 5-8.

[0046] Utilize one hundred grid test (ASTM D3330), four-point probe method test and hardness test (ASTMD3363) to measure the...

Embodiment 9-12

[0056] A mixture of 5wt% polyvinyl alcohol and ethanol solvent containing 1wt% multi-walled carbon nanotubes (Mingxin Technology, CN104Q carbon nanotubes) was coated on a thickness of 150 μm, the glass transition temperature was 125°C, and the insulation resistance was 1.42X10 14 Ω / sq polycarbonate (PC) substrate, after baking and curing at 150°C, a surface treatment layer is formed, and its insulation resistance is 1.07X10 13 Ω / sq.

[0057] 50wt% silver organic acid (C 7 h 15 COOAg) was dissolved in 50wt% xylene to obtain a uniformly mixed silver metal ink, which was coated on the above-mentioned surface treatment layer through a spin-coating process, using a background temperature of 150°C and supplemented by far-infrared light irradiation for metal conductive ink sintering to form the conductive film layer of embodiment 9-12.

[0058] Utilize one hundred grid test (ASTM D3330), four-point probe method test and hardness test (ASTMD3363) to measure the conductive film laye...

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Abstract

The invention relates to a base board combination with a conducting film layer and a manufacture method thereof. The base board combination comprises a macromolecule substrate, a surface treatment layer formed on the macromolecule substrate and the conducting film layer formed on the surface treatment layer. The surface treatment layer is formed by an auxiliary firing filling material and a macromolecule composite material, the conducting film layer is formed by firing metal electric conduction printing ink, the auxiliary firing filling material in the surface treatment layer has energy conduction characters and conducts energy to the metal electric conduction printing ink in an auxiliary mode, and the base board combination is favorable for firing of the metal electric conduction printing ink.

Description

【Technical field】 [0001] The invention relates to a substrate assembly, in particular to a substrate assembly with a conductive film layer and a manufacturing method thereof. 【Background technique】 [0002] At present, most applications of flexible electronic technology are to directly print conductive circuits on flexible substrates to reduce manufacturing costs. In order to achieve highly reliable conductive circuits, it is necessary to increase the adhesion between the conductive circuits and the flexible substrate. [0003] The conventional ways to increase the adhesion between the conductive circuit and the flexible substrate can be divided into conductive ink modification type for enhanced adhesion of conductive ink, and substrate modification type for enhanced adhesion of substrate. The conductive ink modification method is, for example, mentioned in US Patent Publication No. US 2007 / 0048514 to increase the adhesion strength between the conductive layer and the polyme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/04B32B27/20C09D11/00C09D11/52
Inventor 卢俊安林鸿钦陈世明丁文彬
Owner IND TECH RES INST