Buffer material for hot press and application thereof
A technology of cushioning materials and hot presses, applied in lamination, lamination devices, layered products, etc., can solve the problems of aggravated contamination, easy contamination, and expensive cleaning costs, and achieve easy adsorption and transfer, good Cushioning and the effect of improving process convenience
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Examples
Embodiment 1
[0039] Pour DuPont's ETFE glue (the temperature of the glue is maintained at 280℃ to 300℃) into a preheated mold (the preheating temperature of the mold is from 100℃ to 150℃), and the glue will remain in the mold for 1 minute to 2 minutes After that, the mold was removed and the resulting molded product was cooled to room temperature to prepare a smooth sheet of ETFE (buffer material 1) with a thickness of about 0.2 mm. The related properties of the buffer material 1 were measured by the aforementioned measurement method, and the results are recorded in Table 1.
[0040] Use single-layer buffer material 1 as figure 1 The upper and lower buffer layers of the stacked structure of the hot press are shown, and the hot pressing operation is performed under the following conditions to produce a copper foil coated laminate:
[0041] Laminated board material: four laminated prepregs, and a 1 ounce copper foil is laminated on each of the outermost layers on both sides. The prepreg is 7628 ...
Embodiment 2
[0045] Pour DuPont's PTFE glue (the temperature of the glue is maintained at 330°C to 350°C) into a preheated mold (the mold preheat temperature is 100°C to 150°C), and the glue is maintained in the mold for 1 minute to 2 minutes After that, the mold was removed and the resulting molded product was cooled to room temperature to prepare a smooth sheet of PTFE (buffer material 2) with a thickness of about 0.2 mm. The related properties of the buffer material 2 were measured by the aforementioned measurement method, and the results are recorded in Table 1.
[0046] The hot pressing operation was performed in substantially the same manner as in Example 1, but the single-layer buffer material 2 was used as the upper and lower buffer layers, respectively. Observe the adhesion of the buffer material 2 after the hot pressing operation, and the results are recorded in Table 1.
Embodiment 3
[0048] The glass fiber cloth of Taiwan Glass Company (model: 7628, thickness: 170 microns) is impregnated in the PTFE glue solution as in Example 2, and the glass fiber cloth is taken out and molded by compression molding (molding temperature: 150°C to 200°C) The glass fiber cloth was processed in a manner to obtain a smooth sheet of glass fiber-containing PTFE (buffer material 3) with a thickness of about 0.24 mm. The related properties of the buffer material 3 were measured by the aforementioned measurement method, and the results are recorded in Table 1.
[0049] The hot pressing operation was performed in substantially the same manner as in Example 1, but using the single-layer buffer material 3 as the upper and lower buffer layers respectively, and the adhesion of the buffer material 3 after the hot pressing operation was observed. The results are recorded in Table 1.
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Abstract
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