Adhesive Resin Composition, Its Cured Product And Adhesive Film

Abstract

The present invention provides an adhesive resin composition which has high heat conductivity and no easy adhesion force and insulation reduction. The adhesive resin composition comprises the following components: epoxy resin (which comprises epoxy resin of which the mass is above 50wt% relative to total mass of the epoxy resin and epoxide equivalent is 150-220), curing agent which is composed of imidazolium compound, phenoxy resin and aluminum oxide powder, wherein ammonium ion in the cured object is less than 50wtppm. Maximal diameter of the aluminum oxide powder is less than 120 mu m, and the proportion of crystal spherical aluminum oxide in total aluminum oxide powder is above 90wt%. The diameter arrangement of the crystal spherical aluminum oxide satisfies the following conditions: i) the particles of which the average diameter D50 is 35-50 mu m and the ratio (volume average diameter)/(number average diameter) is 1.2-2.0 account for 30-50wt%; ii) the particles of which the average diameter is 5-15 mu m and the ratio (volume average diameter)/(number average diameter) is 2.0-3.5 account for 30-50wt%; and iii) the particles of which the average diameter D50 is 0.1-2 mu m account for 10-30wt%.

Description

technical field [0001] The present invention relates to an adhesive resin composition, a cured product thereof, and an adhesive film for use in forming an insulating adhesive layer on, for example, a circuit board or an electronic component. Background technique [0002] Epoxy resins are excellent in adhesiveness, mechanical strength, and electrical insulation, and can have functions suitable for various uses by combining resins, curing agents, modifiers, and the like. Therefore, epoxy resins are often used, for example, as circuit board materials, adhesives for electronic components, sealants, and the like. In recent years, the high performance and high density of electric and electronic equipment have been progressing, and along with this, countermeasures against heat radiation generated by electronic components mounted on circuit boards have been sought. Therefore, filling an epoxy resin composition for a circuit board with a highly thermally conductive inorganic filler ...

AI Technical Summary

Problems solved by technology

However, since the epoxy equivalent of the epoxy resin used in the adhesive composition of Patent Document 3 is large, the glass transition temperature (Tg) of the cured product is low.

In addition, as a comparative example, a composition composed of an epoxy resin composition having an apparent epoxy equivalent of 250 or less and an imidazole compound is disclosed, but the release property, flexibility, and heat resistance of the cured product are described ( Dielectric resistance after heating) becomes poor