Hermetic package method and structure of transistor base and transistor pin

Abstract

The invention discloses a hermetic package method and structure of a transistor base and a transistor pin. According to the invention, when a transistor pin (2) of a transistor is fixed on a metal transistor base (1) of the transistor, and a glass insulator assembly which is composed of a welding sleeve (3) and a glass insulation layer (4) is made on the transistor pin (2) in advance; when the welding sleeve (3) is made, a circle of flange (3.1) is also made on the port of one end of the welding sleeve (3), and a transistor pin (2) with the glass insulator assembly is inserted in a transistor pin hole of the metal transistor base (1), the flange (3.1) of the welding sleeve (3) is in contact with the metal transistor base (1), and than the welding sleeve (3) and the metal transistor base (1) are welded together on the flange (3.1) of the welding sleeve (3) in a brazing manner. The hermetic package method and structure provided by the invention have the advantages of convenience for operation, good production quality, low cost, low processing accuracy requirement, high production efficiency, good product quality and the like.

Description

technical field [0001] The invention relates to a hermetic packaging method and structure of a transistor base and pins, and belongs to the technical field of semiconductor transistor production. Background technique [0002] The hermetic packaging of metal stems and pins of semiconductor transistors is an important technology to ensure the isolation of chips in the cavity of semiconductor devices from harmful atmospheres such as moisture and oxygen in the atmosphere. This technology can better ensure the performance of semiconductor devices. At present, in the prior art, the straight cylindrical sealing technology is often used to hermetically seal the metal socket and the pin. The straight cylindrical sealing technology is to first burn the glass insulator assembly on the pin, and then The glass insulator assembly is brazed to the metal socket. The existing straight packaging technology mainly relies on the matching accuracy of the outer diameter of the welding sleeve on ...

AI Technical Summary

Problems solved by technology

When the fit gap is too large, weld material leakage will occur, which is not only difficult to achieve the plugging effect, but also its silver-copper solder will often block the suspension hole after brazing; It is difficult to assemble, and at the same time, the copper base plate will be slightly deformed after brazing, which will cause the bottom surface of the component kovar tube to protrude from the lower plane of the tube seat, thus affecting the quality of the product

Therefore, the existing hermetic packaging method of the transistor base and pins not only has the problems of high processing precision and high production cost, but also has the problems of difficult operation and unstable production quality.

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