Light emitting diode (LED) ceramic substrate and production method thereof

A technology of ceramic substrate and manufacturing method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor high-power current passability, poor bonding force of ceramic layers, cumbersome manufacturing process, etc., and achieve low manufacturing cost, energy efficiency and use The effect of improved life and simple production process

Active Publication Date: 2012-07-11
张家港东能电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the LED ceramic substrate in the prior art, especially the production of thin film electrode circuits on the LED ceramic substrate of alumina or aluminum nitride. The process is cumbersome, the bonding force with the ceramic layer is poor, the passability of high-power current is poor, and the solderability is poor. An improved LED ceramic substrate is provided.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The manufacturing method of the LED ceramic substrate of this embodiment includes the following steps:

[0028] (1) By weight percentage, weigh 75% silver powder, 2% glass powder, 5% organic resin, 18% organic solvent, mix the components, and then grind and stir for 24 hours to make electrode circuit slurry;

[0029] (2) Use the electrode circuit paste prepared in step (1) to print on the surface of the ceramic layer, level the surface for 10-15 minutes, and then dry; the shape and thickness of the printing template should be prepared according to the pre-design; before printing , The ceramic plate should be ultrasonically cleaned first, then cleaned with pure water, and then centrifugally dehydrated and dried to make the surface of the ceramic layer smooth and clean;

[0030] (3) sintering the dried ceramic substrate printed with the electrode circuit in step (2) at a temperature of 440° C. for 10-15 minutes;

[0031] (4) Continue sintering the ceramic subst...

Embodiment 2

[0034] The manufacturing method of the LED ceramic substrate of this embodiment includes the following steps:

[0035] (1) By weight percentage, weigh 77.5% silver powder, 1.5% glass powder, 4% organic resin, 17% organic solvent, mix the components, and then grind and stir for 24 hours to make electrode circuit slurry;

[0036] (2) Use the electrode circuit paste prepared in step (1) to print on the surface of the ceramic layer, level the surface for 10-15 minutes, and then dry; the shape and thickness of the printing template should be prepared according to the pre-design; before printing , The ceramic plate should be ultrasonically cleaned first, then cleaned with pure water, and then centrifugally dehydrated and dried to make the surface of the ceramic layer smooth and clean;

[0037] (3) sintering the dried ceramic substrate printed with the electrode circuit in step (2) at a temperature of 450° C. for 10 to 15 minutes;

[0038] (4) Continue sintering the cerami...

Embodiment 3

[0041] The manufacturing method of the LED ceramic substrate of this embodiment includes the following steps:

[0042] (1) By weight percentage, weigh 80% silver powder, 1% glass powder, 5% organic resin, 14% organic solvent, mix the components, and then grind and stir for 24 hours to make electrode circuit slurry;

[0043] (2) Use the electrode circuit paste prepared in step (1) to print on the surface of the ceramic layer, level the surface for 10-15 minutes, and then dry; the shape and thickness of the printing template should be prepared according to the pre-design; before printing , The ceramic plate should be ultrasonically cleaned first, then cleaned with pure water, and then centrifugally dehydrated and dried to make the surface of the ceramic layer smooth and clean;

[0044] (3) sintering the dried ceramic substrate printed with the electrode circuit in step (2) at a temperature of 460° C. for 10-15 minutes;

[0045] (4) Continue sintering the ceramic subst...

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Abstract

The invention relates to a light emitting diode (LED) ceramic substrate and a production method thereof. The LED ceramic substrate comprises a ceramic layer and an electrode circuit which is arranged on the surface of the ceramic layer. The electrode circuit is formed on the surface of the ceramic layer through printing and sintering by metal silver slurry. The electrode circuit comprises the following compositions in part by weight: 75 to 80 parts of silver powder, 1 to 2 parts of glass powder and 5 to 5 parts of resin. The heat radiation property, solderability, insulation safety, energy efficiency and service life of the LED ceramic substrate can be improved; the thickness of the electrode circuit can be adjusted at will within the range of 10 micrometers to 60 micrometers according tothe technical requirements, and maximal power current can be allowed to flow by; and the vertical adhesion force between the electrode circuit and the ceramic layer is more than or equal to 50N/(2*2)mm<2>. The production method is low in cost and simple in process, and favors the popularization of LED lamps.

Description

technical field [0001] The invention relates to an LED ceramic substrate and a manufacturing method thereof. Background technique [0002] As a new type of light-emitting device, light-emitting diode (LED) has many advantages such as energy saving, environmental protection, long service life, and fast start-up speed. It can be used in many fields such as electronic communications, electro-optical panels, and liquid crystal displays. Generally speaking, the LED light-emitting chip is bonded to the substrate by gold wire, eutectic or flip-chip to form an LED chip, and then the LED chip is fixed on the circuit board of the system. The existing LED substrates mainly include metal substrates and ceramic substrates. The technology of connecting metal substrates to LED light-emitting chips has disadvantages such as poor heat dissipation and poor insulation. The use of ceramic substrates has good heat dissipation. It is necessary to make electrode lines on the ceramic layer. There...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
Inventor 严建华
Owner 张家港东能电子科技有限公司
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