High thermal load large power semiconductor laser

Abstract

The invention relates to a high thermal load large power semiconductor laser which comprises a housing, a TEC refrigerator, a heat sink, a semiconductor laser chip assembly, and a circuit board. The semiconductor laser chip assembly is a chip assembly based on COS packaging and comprises a heat radiation substrate and a laser chip which is pasted on the heat radiation substrate. The heat radiation substrate is pasted on the heat sink. The circuit board is a circuit board whose metal surface is coated with ceramic, and the circuit board and the semiconductor laser chip assembly are electrically connected through a connecting copper sheet. The semiconductor laser has a good heat radiation effect, and manufacture of a large power laser can be realized. Simultaneously, the semiconductor laser chip is fixed with the heat sink by employing a pasting mode without deformation or displacement, influence on a product brought by change of machinery, temperature and the like can be overcome, and the reliability of the product is ensured.

Description

technical field [0001] The invention relates to a laser device, which can be used as a light source in systems such as optical communication, optical processing, and optical display. Background technique [0002] Semiconductor lasers develop rapidly due to the expansion of wavelength, the emergence of high-power laser arrays, and the emergence of compatible laser light guides and computer control of laser energy parameters. Semiconductor lasers are small in size, light in weight, low in cost, and have selectable wavelengths, and their application ranges are becoming wider and wider. [0003] Existing semiconductor lasers with high heat load are usually mainly composed of a tube shell, a refrigerator arranged in the tube shell, a heat sink, and a semiconductor laser chip assembly fixed on the heat sink. Among them, semiconductor laser chip components generally use C-mount packaging, such as Figure 5 shown. It includes a heat conduction substrate 10 , a laser chip 20 fixed ...

AI Technical Summary

Problems solved by technology

[0004] This C-mount packaging method, due to the structural limitation, the effective area of ​​the thermally conductive substrate 10 is small, and the area in contact with the heat sink is limited, resulting in a relatively small optical power, generally only below 8W

Moreover, since the semiconductor laser chip assembly can only be fixed on the heat sink by one screw, the stability is poor, and the position of the laser chip assembly is prone to change during use, which is easy to cause light in a micron-scale fiber coupling system. Coupling efficiency decreases, resulting in lower reliability of semiconductor lasers

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