Ceramic capacitor structure

Abstract

The invention discloses a ceramic capacitor structure, which comprises one or more capacitor substrates and a plurality of support plates, wherein the capacitor substrates are positioned on opposite inner sides of every two support plates respectively; electrode conductors on two side surfaces of the capacitor substrates are electrically connected with metal circuit layers on opposite inner side surfaces of the two support plates respectively, and are in staggered and overlapped states; an insulating layer is molded integrally between each capacitor substrate and the inside of each support plate; slots for exposing the metal circuit layers are longitudinally formed on two vertical side planes of each insulating layer respectively; and the surfaces of the slots and the support plates are provided with outer end part electrodes which are covered on the metal circuit layers and are connected electrically. By means of a large-area circuit layout design with a plurality of support plates, a plurality of capacitor substrates can be connected in parallel on a single main body according to the requirements of a manufacturer, and the effects of reducing area and increasing capacitance value are achieved in a modular laminating way in accordance with the manufacturing specification of a ceramic capacitor simultaneously, so that quick volume production can be more simply and easily performed, and the cost can be saved effectively.

Description

technical field [0001] The present invention provides a ceramic capacitor structure, in particular, multiple capacitor base materials can be arranged in parallel on a single body by utilizing the circuit layout design of multiple substrates, and present a stacked state of interlaced stacking, so as to achieve reduced area, The effect of increasing the capacitance value can also speed up production and save labor costs. Background technique [0002] Today's electronic products and their peripheral related electronic equipment all use active components and passive components. Active components (such as microprocessors or chips, etc.) are functions that can perform calculations and processing independently, while passive components are When the current or voltage is changed, the resistance or impedance of the component will not change accordingly, and the resistance, capacitance and inductance are collectively called the three passive components, and the three can be used in in...

AI Technical Summary

Problems solved by technology

[0005] However, with the development trend of high-density integrated circuits and stronger functions, the size of ceramic capacitors must also be made smaller and smaller. The standard operating procedure for existing ceramic capacitors is to use two metal wires C to use artificial plug-ins or Manual post-soldering is used for the production of downstream products. This kind of production method using metal wire C will reduce the degree of automation. In addition to requiring a lot of manual plug-in to the circuit board and welding procedures, it will consume more man-hours and In addition to greatly increasing the cost, the manual insertion must also be quite accurate, otherwise the metal wire C will be easily squeezed, deformed or broken due to the difficulty in assembly, not only the overall produ

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