A power device package-free structure of a radio frequency power amplifier module and its assembly method

Abstract

An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module includes the power device, a heat dissipating plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat dissipating plate is arranged below the power device and the printed circuit board; the power device includes a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat dissipating plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires.

Description

technical field [0001] The invention relates to the design of radio frequency power amplifiers in the field of wireless communication, in particular to a power device non-encapsulation structure of a radio frequency power amplifier module and an assembly method for the structure. Background technique [0002] At present, in the field of wireless communication, the structure of the mainstream high-power RF power amplifier module is as follows: figure 1 As shown, it includes a packaged power device, a printed circuit board, and a heat dissipation plate arranged under the packaged power device and the printed circuit board. The packaged power device has a ceramic package. When the user is using it, the inside of the packaged device is shielded from the user. The user cannot make any changes to the internal pre-matching. The performance of the device is largely limited by the design of the device provider. Additionally, if figure 2 As shown, because the traditional packaged p...

AI Technical Summary

Problems solved by technology

In addition, if figure 2 As shown, because the traditional packaged power device has input and output pins, when the user uses it, the electronic components on the packaged power device are connected to the input and output pins through the lead wire (Bond-wire), and the input and output pins are soldered and fixed on the The printed circuit board makes the power device and the printed circuit board electrically connected, so the conductive width of the user's printed circuit board cannot be narrower than the width of the packaged device, which contradicts the current trend of equipment miniaturization

At the same time, because the package of the packaged device will inevitably bring about the influence of parasitic capacitance, and the input and output pins must have their own inductance, when the error caused by the welding process between the input and output pins and the printed circuit board is also large, this It will have a direct impact on the matching circuit of the device, thereby affecting the performance index of the device

Images