Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition
A technology of epoxy resin and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve problems such as poor hole filling, layered explosion, and decreased drilling processability. Achieve high glass transition temperature, meet reliability requirements, and achieve low melt viscosity
Inactive Publication Date: 2012-08-15
GUANGDONG SHENGYI SCI TECH
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Problems solved by technology
The epoxy used is also replaced from the traditional brominated bisphenol A type epoxy resin to a novolac epoxy resin with better heat resistance, such as phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A type Novolac epoxy resin, dicyclopentadiene type novolac epoxy resin, etc. can effectively improve the heat resistance of the cured product, but the use of general novolac epoxy resin and phenolic resin brings about high brittleness of the cured product and poor drilling processability. Decrease, leading to the phenomenon of delamination and explosion in the lead-free process
[0003] In addition, adding fillers can effectively reduce the thermal expansion coefficient of the cured product, but due to the addition of fillers, the fluidity becomes worse, and the hole filling performance of the printed circuit board process becomes worse. Under the application of lead-free process conditions, occurrence Defects such as reduced reliability and glass yarn cracking
Method used
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Experimental program
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Embodiment 1
[0046] Get a container, add 53 parts by weight of phenolic novolac epoxy resin PN177 (Changchun artificial resin factory in Taiwan), 20 parts by weight of brominated bisphenol A type epoxy resin DER530 (Dow Chemical, bromine content 18%~20%), High bromine epoxy resin BEB400 (Taiwan Changchun Artificial Resin Factory, bromine content 46%~50%) 27 parts by weight, then add 28 parts by weight of phenolic curing agent MEH-7500 (Japan Minghe Chemical, hydroxyl equivalent 96g / mol), and solvent The methyl ethyl ketone is stirred for a certain period of time to obtain a transparent glue, and then an appropriate amount of 2-methylimidazole is added, and the stirring is continued to form a glue. Use glass fiber cloth (type 7628, thickness 0.16mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to prepare a prepreg. A plurality of prepregs prepared are stacked on each other, a piece of copper foil is laminated on each side ...
Embodiment 2～9
[0048] The manufacturing process is the same as in Example 1, and the formula composition and physical property data are as shown in Tables 1 and 2.
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Abstract
The invention relates to an epoxy resin composition and a prepreg and a copper-coated laminate which are made of the epoxy resin composition. The epoxy resin composition comprises the following necessary components of: (A) at least one type of epoxy resin with the melt viscosity of not more than 0.5Pa.s under the condition of 150 DEG C, and (B) phenolic resin with the structural formula represented by the formula I as shown in the specification, wherein n is an integer ranging from 0-10. The epoxy resin composition can provide high glass transition temperature, high heat resistance, low expansion coefficient and low hygroscopicity for the prepreg and the copper-coated laminate which are made of the epoxy resin composition, and the requirement for high reliability of a multi-layer printed circuit board can be met.
Description
technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a prepreg and a copper-clad laminate made of the epoxy resin composition. Background technique [0002] At present, with the full implementation of lead-free technology, higher requirements are put forward for the heat resistance of copper clad laminates. The traditional dicyandiamide used as epoxy resin curing agent for copper clad laminate materials can no longer meet the lead-free heat resistance. and reliability requirements. In order to meet this technical requirement, phenolic resin is often used in the industry to replace dicyandiamide as epoxy resin curing agent, and adding inorganic fillers can effectively improve the heat resistance of the cured product and reduce its expansion coefficient, so as to provide better Reliability in printed circuit board applications. The epoxy used is also replaced from the traditional brominated bisphenol A ty...
Claims
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IPC IPC(8): C08G59/62C08G59/20C08G59/32C08L63/00C08K13/06C08K9/06B32B15/092B32B27/04H05K1/03
CPCH05K1/056C08L63/00C08L71/08C08G59/62Y10T428/31522
Inventor 曾宪平唐军旗
Owner GUANGDONG SHENGYI SCI TECH