Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Dry film photoresist containing special adhesive additive and plasticizer

A technology of photoresist and plasticizer, which is applied in the field of dry film photoresist developed by aqueous solution, and can solve the problems of negative impact of component adhesion, negative impact of exposure time and development time, leakage, etc.

Inactive Publication Date: 2012-08-29
ZHUHAI DYNAMIC TECH OPTICAL IND
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the distribution of photopolymerizable components, a precise balance of various components must be maintained, and substances that play a good role in the flexibility of photoresists, even if used in small amounts, may still affect the exposure time and development time. Will have a negative effect or have a negative effect on the adhesion of the component
Currently used plasticizers such as N-ethyl-toluenesulfonamide have been added to the formulation of the photopolymerizable component to increase flexibility, however, this plasticizer can leak out of the component thus limiting its validity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dry film photoresist containing special adhesive additive and plasticizer
  • Dry film photoresist containing special adhesive additive and plasticizer
  • Dry film photoresist containing special adhesive additive and plasticizer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0050] The preparation of the adhesive used for photoresist, its formula is listed in Table 1.

[0051] Table 1

[0052]

[0053] 1: methylendenoic acid

[0054] 2: Methyl methacrylate

[0055] 3: Ethyl acrylate

[0056] 4: Isobornyl methacrylate

[0057] The synthesis of the binder is as follows. 422g of methyl ethyl ketone and 555g of the mixed monomers in Table 1 were added to a reaction vessel, and the reactants were stirred and heated to 80°C under nitrogen. Add 7ml azobisisobutyronitrile, butanone solution (concentration is 0.05g azobisisobutyronitrile / g butanone) in the reaction vessel, add 19ml azobisisobutyronitrile butanone solution (concentration (0.05g azobisisobutyronitrile / g butanone), continue stirring and heating for 1 hour, after the reaction is completed, the reactant is transferred to a glass container, and an appropriate amount of butanone is added to adjust the solid content to 31%.

[0058] The photoresist is prepared according to the components i...

Embodiment 5-8

[0074] Using the adhesives made in the formulations listed in Table 1, the photoresists were prepared in the formulations listed in Table 5.

[0075] table 5

[0076]

[0077]

[0078] 1. with the adhesive of embodiment 1

[0079] 2. with the adhesive of embodiment 2

[0080] 3. with the adhesive of embodiment 3

[0081] 4. with the adhesive of embodiment 4

[0082] 5.PUT polyurethane, see embodiment for preparation

[0083] *. Same as table 2 embodiment 1-4.

[0084] As described in Examples 1-4 above, the photoresist was pressed onto the copper foil substrate, exposed, developed, etched and tested, and the results are listed in Table 6.

[0085] Table 6

[0086] Example

Embodiment 9-13

[0088] The adhesives in Examples 9-13 were prepared according to the formulations in Table 7.

[0089] Table 7

[0090]

[0091] 1: Methacrylic acid

[0092] 2: Methyl methacrylate

[0093] 3: Ethyl acrylate

[0094] 4: Dicyclopentene oxymethacrylate

[0095] The photoresists of Examples 9-13 were prepared using the binders listed in Table 7 and the methods described in Examples 1-4.

[0096] Table 8

[0097]

[0098] *. Same as Embodiment 1-4

[0099] As described in Examples 1-4 above, the photoresist was pressed onto the copper foil substrate, exposed, developed, etched and tested, and the results are listed in Table 9.

[0100] Table 9

[0101] Example

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a dry film photoresist for aqueous solution development. The components thereof include a macromolecule adhesive, a free radical photoinitiator, monomers capable of having addition polymerization, a plasticizer and a thermal polymerization inhibitor. The dry film photoresist is characterized in that the macromolecule adhesive is an adhesive containing a carboxylic group and capable of forming a film, and is formed by polymerizing a mixture including components as follows (a) a monomer having a molecular formula of H2C=CRCOO[(CnH2n)X(CpH2p)]R', wherein R refers to hydrogen or methyl, R' refers to saturated or unsaturated C5-C12 crosslink alkyl which also can be replaced by at least one C1-C4 alkyl or hydrogen, x refers to an oxygen or sulfur atom, n ranges from 2 to 4, p ranges from 0 to 4, and m ranges from 0 to 2; and (b) at least one C3-C15, alpha, beta-unsaturated monomer containing a carboxyl group and 3-15 carbon atoms. The plasticizer contains carboxy polyurethane, the molecular weight ranges from 10,000 to 100,000, a free carboxyl group is introduced onto a main chain, and at least one olefinic bond unsaturated terminal group is provided.

Description

technical field [0001] The invention relates to an aqueous solution developed dry film photoresist, in particular to a dry film photoresist containing a carboxyl-forming polymer binder and a carboxyl-containing polyurethane solution-developed dry film photoresist resist. Background technique [0002] Aqueous solution-developed dry film photoresists are photopolymerizable components used in the production of printed circuit boards. These photoresists are usually coated with a resist solution on a transparent polyester film carrier, and then coated The solvent evaporates to form a dry film. Under normal circumstances, the dry film photoresist is used together with the carrier on the copper-covered substrate, and the dry film is cured by exposure through the carrier and the negative film in a certain area, and then washed with an alkaline aqueous solution to remove the untreated copper from the copper surface. The exposed dry film and the exposed copper layer are removed by e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/033
Inventor 邱红斌陆德凯
Owner ZHUHAI DYNAMIC TECH OPTICAL IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products