Soil covering culture method for flower mushrooms

A cultivation method and soil-covering technology, applied in botany equipment and methods, horticulture, applications, etc., can solve the problems of less than 100% biotransformation rate, low flowering mushroom rate, and many processes, so as to reduce sterilization time and improve The effect of yield rate and simple process

Inactive Publication Date: 2012-09-12
何寒
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Judging from the above-mentioned technological process, the production process of the traditional flower shiitake mushroom method has many and loaded down with trivial details
It has

Method used

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Embodiment Construction

[0019] Below in conjunction with embodiment the method of the present invention is further described.

[0020] A soil-covering cultivation method of shiitake mushroom, the specific implementation method is as follows:

[0021] 1. Composition and ratio of raw materials: 59% miscellaneous wood sawdust, 26% corn cob, 14% wheat bran, 1% gypsum powder, and appropriate amount of water.

[0022] 2. Mixing fermentation: Mix the above-mentioned miscellaneous wood sawdust, corncobs, wheat bran, and gypsum powder and stir them evenly to form a mixture, then mix them with an appropriate amount of water and adjust the water content of the mixture to 55 ~60%; then pile up the mixed material and carry out anaerobic fermentation until the mixed material turns brown or dark brown, has no peculiar smell, and is soft and elastic in hand to obtain the medium material for production.

[0023] 3. Sterilization by bagging: Put the medium material for production into a plastic bag with a specificati...

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Abstract

The invention relates to the new technical field of edible fungus culture, in particular to a soil covering culture method for flower mushrooms. According to the soil covering culture method, the traditional mode of directly bagging and sterilizing raw materials is changed into a mode of fermenting, bagging and sterilizing the raw materials in the flower mushroom production process, so that half time can be shortened during sterilization, and the yield of fungus bags is improved; during production and culture, bag removing and soil covering, and openness for mushroom growth are adopted, and in the management process, dry wet difference is large, and water dry-wet alternation management is carried out to stimulate the formation of the flower mushrooms, so the rate of the flower mushrooms is about 70 percent, the total biological efficiency is over 140 percent and the yield is improved by about 45 percent compared with that of the conventional culture method; and after soil covering, hyphae change color naturally, and are hardly infected with sundry fungi, and complicated management procedures of removing bags to change color, promoting mushrooms, cutting the bags to culture buttons, culturing the flower mushrooms by creating a dry environment and increasing illumination intensity and the like in the conventional method are eliminated.

Description

technical field [0001] The invention relates to the field of a new technology for cultivating edible fungi, in particular to a soil-covered cultivating method for shiitake mushrooms. technical background [0002] Flower shiitake mushrooms are cultivated in a special environment during the production process of shiitake mushrooms. They are more nutritious and have higher commodity value than shiitake mushrooms. Therefore, shiitake mushrooms are treasures in shiitake mushrooms. Flower shiitake mushrooms also have the characteristics of round mushrooms, thick flesh, fine quality, white color, natural explosion, beautiful appearance, crisp and smooth taste, delicious and unique taste, and no spongy body. Shiitake mushrooms contain 17 kinds of essential amino acids. Long-term consumption can enhance human immunity and have the effect of reducing cancer. It is a treasure in the series of edible fungi. [0003] Shiitake mushrooms can be sold fresh, or dried, stored and packaged fo...

Claims

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Application Information

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IPC IPC(8): A01G1/04
Inventor 何寒
Owner 何寒
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