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Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method

A composite material and chip technology, applied in chemical instruments and methods, synthetic resin layered products, resistors with positive temperature coefficients, etc., can solve problems such as lack of direct curing ability, achieve less pores, overcome long-term processing technology , The effect of low room temperature resistance

Inactive Publication Date: 2012-09-12
上海神沃电子有限公司
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Problems solved by technology

[0007] The purpose of the present invention is to use basic thermosetting resins as polymer PTC substrates, which do not need to be chemically modified in advance, have direct curing capabilities that thermoplastic resins do not have, high peel strength after curing, and excellent electrical properties. The disadvantages of thermoplastic resin are long processing technology and complicated heat treatment process.

Method used

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  • Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method
  • Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method
  • Phenylthiocarbamide (PTC) composite material and PTC chip prepared by same and preparation method

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Embodiment Construction

[0037] Such as Figure 1-2 Schematically, the thermosetting polymer PTC chip of the present invention is composed of a cured polymer composite material core material and metal foils pasted on both sides of the core material, and the simplest thermosetting PTC chip can be formed by welding pins on the metal foil. Components, which can also be coated with insulating materials.

[0038] The core material is cured by a thermosetting polymer PTC composite material, and the thermosetting polymer PTC composite material is composed of a thermosetting resin, a curing agent, a polymer filler, conductive ceramic particles, and other additives. The formula is as follows (by mass percentage):

[0039] Material (mass percentage%) Recipe 1 Recipe 2 Recipe 3 Recipe 4 Recipe 5 Recipe 6 Recipe 7 Recipe 8

[0040] Epoxy: 5 10 20 10 20 15 30 20

[0041] Anhydride curing agent: 5 10 20 10 20 -- -- 20

[0042] Ester cyclic amine curing agent: -- -- -- -- -- 5 10 --

[0043] Polyethylene packin...

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Abstract

The invention relates to a phenylthiocarbamide (PTC) composite material and a PTC chip prepared by same and a preparation method. The invention discloses a PTC composite material, and the composite material comprises the following ingredients by mass percent: 5 to 20 percent of thermosetting resin, 5 to 20 percent of a curing agent, 1 to 20 percent of polymer packing, 39.5 to 88.5 percent of conductive ceramic particles and 0.5 to 1.0 percent of other assistants. The invention also discloses a PTC chip and a preparation method. The polymer PTC chip has advantages that the processing flow is short, no solvent and no radiation exist in the manufacturing process, the resistance is low, the electrode stripping strength is high and the like.

Description

technical field [0001] The present invention relates to an electronic component for overcurrent protection, more specifically, the present invention relates to a thermosetting polymer PTC composite material and a thermosetting polymer PTC chip made of the thermosetting polymer PTC composite material, and a PTC Chip preparation method. Background technique [0002] Polymer PTC composite materials and polymer PTC electronic components developed on the basis of them have been widely used in the field of modern electronics and electronics. Such composite materials and electronic components composed of them are generally referred to as polymer PTC (Positive Temperature Coefficient Materials / element). [0003] At present, the main polymer resins used in the synthesis and manufacture of polymer PTC materials are thermoplastic resins represented by polyethylene and polyvinylidene fluoride. The thermoplastic resin and conductive filler are dispersed and mixed, calendered, and lami...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08L75/04C08L83/04C08L23/06C08L23/16C08L27/16C08L9/02C08K3/28C08K3/14B32B15/08B32B27/18H01C7/02
Inventor 赵亮史宇正侯李明
Owner 上海神沃电子有限公司
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