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Intermediate temperature solidified prepreg and preparation method thereof

A prepreg material, medium temperature technology, applied in chemical instruments and methods, pretreatment surfaces, epoxy resin coatings, etc., can solve problems such as non-compliance with safety and environmental protection, application surface limitations

Inactive Publication Date: 2012-09-19
SUZHOU JUFENG ELECTRICAL INSULATION SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are very few halogen-containing epoxy resins, such as brominated epoxy resins, which do not meet the requirements of safety and environmental protection
Moreover, these materials generally have to be fully cured at a high temperature of 150-160°C, and their application is greatly limited.

Method used

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  • Intermediate temperature solidified prepreg and preparation method thereof
  • Intermediate temperature solidified prepreg and preparation method thereof
  • Intermediate temperature solidified prepreg and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment provides a medium temperature curing prepreg material. Such as figure 1 As shown, the medium-temperature curing prepreg material includes a base 1 and a halogen-free flame-retardant epoxy resin layer 2 disposed on both sides of the base 1 in a semi-cured state. The substrate 1 adopts polyester non-woven polyester film polyester non-woven composite foil (DMD). The substrate 1 is specifically composed of a polyester non-woven fabric 10 , a first adhesive layer 11 , a polyester film 12 , a second adhesive layer 13 and a polyester non-woven fabric 14 arranged in sequence. The adhesive used in the first adhesive layer 11 and the second adhesive layer 13 is epoxy resin adhesive. The halogen-free flame-retardant epoxy resin layer 2 adopts phosphorus epoxy resin.

[0031] The preparation process of the medium temperature curing prepreg material in this example is as follows:

[0032] (1) Preparation of base material: Bond a layer of polyester non-wove...

Embodiment 2

[0037] This embodiment provides a medium temperature curing prepreg material. Its structure is basically the same as that of Example 1, the difference is that the substrate is polyaramid fiber paper polyimide film polyaramid fiber paper composite foil (AHA). Such as figure 2 As shown, the substrate 1' is composed of polyaramid fiber paper 10', first adhesive layer 11', polyester film 12', second adhesive layer 13' and polyaramid fiber paper 14' arranged in sequence.

[0038] The preparation process of the medium temperature curing prepreg material in this example is as follows:

[0039] (1) Preparation of base material: directly purchased;

[0040] (2), the preparation of glue: with embodiment 1;

[0041] (3) Coating: On the dip coating equipment, pass AHA through the glue tank filled with glue, and then bake and dry in a drying oven. The baking temperature is 140°C, and the baking time is 4 minutes. The medium temperature curing prepreg material.

[0042] Af...

Embodiment 3

[0044] This embodiment provides a medium temperature curing prepreg material. Such as image 3 As shown, the medium-temperature curing prepreg material includes a base 1'' and a halogen-free flame-retardant epoxy resin layer 2'' disposed on both sides of the base 1'' in a semi-cured state. The substrate 1'' adopts polyester film polyester non-woven composite foil (DM). The substrate 1' is specifically composed of a polyester non-woven fabric 10'', an adhesive layer 11'' and a polyester film 12'' arranged in sequence, wherein. The adhesive layer 11'' is made of polyurethane adhesive.

[0045] The preparation process of the medium temperature curing prepreg material in this example is as follows:

[0046] (1) Preparation of base material: Polyester film and polyester non-woven fabric are compounded together with polyurethane adhesive; polyester film polyester non-woven fabric composite foil (DM) is the base material;

[0047] (2) Preparation of glue solution: Add 100...

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Abstract

The invention relates to an intermediate temperature solidified prepreg and a preparation method thereof. The intermediate temperature setting prepreg comprises a sheet-shaped base material, and a halogen-free flame-retardant epoxy resin layer which is formed on one or two surfaces of the base material and under a semi-solidified state, wherein the sheet-shaped base material is a soft single-layer sheet-shaped material; or the sheet-shaped base material comprises multiple soft sheet-shaped materials which are overlapped together in sequence and adhesive layers which are respectively arranged between the two adjacent soft sheet-shaped materials. The solidifying temperature of the intermediate temperature solidified prepreg is 120 DEG C to 130 DEG C, and the solidifying time is 3 to 5 hours. The intermediate temperature solidified prepreg and the method adopt the soft sheet-shaped materials as the base material and innovatively introduces the semi-solidified halogen-free flame-retardant epoxy resin layer to the prepreg, so that the prepreg not only has the performance of flame retarding, but also has the performance of environment friendliness, especially the aim of solidifying at an intermediate temperature (120 DEG C to 130 DEG C) can be realized, and the application range of the prepreg is greatly expanded.

Description

Technical field [0001] The invention is a pre -immersed material field for motor, transformers, electrical and electronic products, etc., which involves a medium temperature curing pre -immersed material and its preparation methods. Background technique [0002] At present, the pre -immersed materials used by motors, transformers, electrical appliances, and electronic products generally use ordinary epoxy resin as an impregnated resin without flame retardant.There are very few halogen -containing epoxy resins, such as bromine epoxy resin, and do not meet the requirements of safety and environmental protection.Moreover, these materials generally can be completely solidified at high temperatures of 150 to 160 ° C, and its application surface is greatly limited. Invention content [0003] The technical problem to be solved by the present invention is to overcome the lack of existing technology and provide a medium temperature curing pre -immersed material that meets environmental p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/12B32B27/04B32B7/12C09D163/00B05D1/00B05D3/02
Inventor 夏宇胡兆楠周成
Owner SUZHOU JUFENG ELECTRICAL INSULATION SYST