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High temperature resistant rubber base composite material used for chip packaging and application thereof

A technology of chip packaging and composite materials, which is applied to record carriers, instruments, electrical components, etc. used in machines. It can solve the problems of lack of moisture-proof, moisture-proof, salt-fog and other anti-harsh environment characteristics, and RFID technology limitations, and achieve excellent moisture-proof. The effect of moisture resistance

Inactive Publication Date: 2012-09-19
NO 33 RES INST OF CHINA ELECTRONICS TECHNOOGY GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Common RFID packaging materials include: paper card packaging and PVC packaging. The use is limited to normal temperature and dry environments. are greatly restricted

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A high-temperature-resistant rubber-based composite material for chip packaging, which consists of the following components in proportion by weight:

[0025] 100 parts of methyl vinyl silicone rubber, 0.5 parts of hydroxyl silicone oil, 5 parts of ultrafine silicon dioxide, 50 parts of hollow glass microspheres, and 5 parts of double 24.

[0026] The application of a high-temperature-resistant rubber-based composite material for chip packaging is carried out in accordance with the following steps: use a mixer to mix methyl vinyl silicone rubber, hydroxyl silicone oil, ultrafine silica, hollow glass microspheres and double 24 according to the above-mentioned Mix the parts by weight evenly, extrude into a sheet with uniform thickness, then cut into small pieces according to the chip size, and package the chip with the cut sheet. The shape of the packaged chip should be uniform and standardized, and then open the lead hole Sintering at a temperature of 160° C. for 15 minut...

Embodiment 2

[0028] A high-temperature-resistant rubber-based composite material for chip packaging, which consists of the following components in proportion by weight:

[0029] 100 parts of methyl vinyl phenyl silicone rubber, 1.2 parts of hydroxy silicone oil, 8 parts of superfine carbon black, 100 parts of hollow glass microspheres, 6 parts of double 25.

[0030] The application of a high-temperature-resistant rubber-based composite material for chip packaging is carried out according to the following steps: use a mixer to mix methyl vinyl phenyl silicone rubber, hydroxyl silicone oil, ultrafine carbon black, hollow glass microspheres and double 25 Mix the above weight parts evenly, extrude into a sheet with uniform thickness, then cut into small pieces according to the chip size, and package the chip with the cut sheet. The shape of the packaged chip should be uniform and standardized, and then open the lead hole, and finally Sintering at a temperature of 168° C. for 12 minutes yields ...

Embodiment 3

[0032] A high-temperature-resistant rubber-based composite material for chip packaging, which consists of the following components in proportion by weight:

[0033] 100 parts of methyl vinyl phenyl silicone rubber, 2 parts of hydroxyl silicone oil, 10 parts of fibrous silicate, 70 parts of hollow glass microspheres, 10 parts of dicumyl peroxide.

[0034] The application of a high-temperature-resistant rubber-based composite material for chip packaging is carried out according to the following steps: use a mixer to mix methyl vinyl phenyl silicone rubber, hydroxyl silicone oil, fibrous silicate, hollow glass microspheres and di Mix the cumene evenly according to the above weight ratio, extrude it into a sheet with uniform thickness, then cut it into small pieces according to the chip size, and package the chip with the cut sheet. The shape of the packaged chip should be uniform and standardized, and then open The lead hole is finally sintered at a temperature of 150° C. for 20 ...

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PUM

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Abstract

The invention discloses a high temperature resistant rubber base composite material used for chip packaging and an application thereof, and belongs to the technical field of the high temperature resistant chip packaging material. The invention aims to provide a high temperature resistant, moisture-proof and damp-proof chip packaging composite material. The high temperature resistant rubber base composite material used for the chip packaging adopts the technical scheme that the high temperature resistant rubber base composite material used for the chip packaging comprises the following raw materials in parts by weight: 100 parts of silicon rubber, 0.1-2 parts of plasticizer, 1-10 parts of reinforcing agent, 50-100 parts of heat insulation microsphere and 1-15 parts of vulcanizing agent. The plastic rubber base composite material related by the invention has a high temperature resistant characteristic, a radio frequency identification device (RFID) chip can be comprehensively protected to normally work in the high temperature environment, the chip is free from being damaged due to overheat at the temperature of 300DEG C, and the packaged chip has an excellent moisture-proof and damp-proof performance.

Description

technical field [0001] The invention discloses a high-temperature-resistant rubber-based composite material for chip packaging and its application, belonging to the technical field of high-temperature-resistant chip packaging materials. Background technique [0002] The term RFID is radio frequency equipment, commonly known as electronic tags, radio frequency tags, transponders, and data carriers. Common RFID packaging materials include: paper card packaging and PVC packaging. The use is limited to normal temperature and dry environments. are greatly restricted. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the invention provides a composite material for encapsulating chips with high temperature resistance, moisture insulation and moisture resistance. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a high-temperature-resistant rubber-based composite...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08K13/04C08K7/28H01L21/56H01L23/29G06K19/07
Inventor 任圣平姚运生王东红王胜利
Owner NO 33 RES INST OF CHINA ELECTRONICS TECHNOOGY GRP
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