Integrated micro pressure flow sensor based on silicon through-hole technology

A flow sensor and pressure sensor technology, which is applied in the measurement of fluid pressure through electromagnetic components, microstructure technology, fluid velocity measurement, etc., can solve the problems of high packaging cost and excessive packaging size, and reduce packaging size and packaging cost. , the effect of expanding the scope of application

Inactive Publication Date: 2012-09-19
刘胜
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

TSV technology solves the defects of the traditional planar packaging process that lead to excessive package size and high packaging cost

Method used

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  • Integrated micro pressure flow sensor based on silicon through-hole technology

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Embodiment Construction

[0009] Embodiments of the present invention are further described below in conjunction with the accompanying drawings:

[0010] see figure 1 , The present invention is composed of MEMS pressure sensor, MEMS flow sensor, ASIC sensor signal conditioning chip 3, TSV interconnection hole 4, bump 5, and pressure introduction through hole 7. The MEMS flow sensor, MEMS pressure sensor, and ASIC sensor signal conditioning chips are vertically stacked in sequence, and are electrically connected through the TSV interconnection holes 4 and bumps 5 . The ASIC sensor signal conditioning chip 3 performs signal conditioning on the MEMS pressure sensor and the MEMS flow sensor. The specific implementation steps are as follows:

[0011] 1. Etching at least one pressure introduction via hole 7 on the MEMS flow sensor substrate 1 . The pressure introduction through hole 7 communicates the cavity 6 of the MEMS flow sensor with the bottom surface of the MEMS flow sensor substrate 1, so that the...

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Abstract

The invention provides an integrated micro pressure flow sensor based on silicon through-hole technology. The flow sensor consists of an MEMS (Micro-electromechanical System) pressure sensor, an MEMS flow sensor, an ASIC (Application Specific Integrated Circuit) sensor signal modulation chip, interconnected through holes and salient points, wherein the MEMS pressure sensor, the MEMS flow sensor and the ASIC sensor signal modulation chip are vertically stacked sequentially and are in electrical connection through the interconnected through holes and the salient points; and the ASIC sensor signal modulation chip carries out signal modulation on the MEMS pressure sensor and the MEMS flow sensor. The flow sensor has the advantages that with the adoption of the silicon through-hole technical process, the packaging size of the sensor is reduced greatly, the packaging cost is reduced, and the application range of the pressure sensor and the flow sensor is enlarged.

Description

technical field [0001] The invention relates to a measuring element, in particular to an integrated MEMS pressure sensor and a flow sensor based on a TSV through-silicon via technology. Background technique [0002] MEMS (micro-electromechanical systems) pressure sensors are widely used in automotive electronics, consumer electronics and industrial electronics, such as engine oil pressure sensors, air pressure sensors for automotive brake systems, ventilators, sphygmomanometers, washing machines, industrial ingredient weighing, etc. MEMS flow sensors can measure flow field parameters such as fluid velocity and flow rate. They have the advantages of low power consumption, fast response and high precision. They are also more and more widely used in industrial control, environmental monitoring, civil, aerospace and other fields. In many occasions, MEMS pressure sensors and MEMS flow sensors need to be used at the same time, so the integration of these two sensors on the package...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/00G01F1/00B81B7/00
Inventor 曹钢张宗阳陈君杰汪学方刘胜
Owner 刘胜
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