Film LED (light-emitting diode) chip device as well as manufacturing method and application thereof
A device manufacturing method and LED chip technology, applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of increased production costs, changes, lack of effective support and heat sinks, etc.
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[0067] Below in conjunction with accompanying drawing and specific embodiment the present invention will be further described:
[0068] see image 3 , the thin film LED chip device, comprising:
[0069] A GaN-based epitaxial film base layer 10 composed of an N-type semiconductor layer 11, an active layer 12, and a P-type semiconductor layer 13 in sequence. In order to improve the external quantum efficiency of the thin film LED chip device made, the surface of the N-type semiconductor layer 11 is a roughened surface 22; or, a passivation layer (not shown) is deposited on the surface of the N-type semiconductor layer 11, The passivation layer is SiO 2 or Si 3 N 4 The material has a thickness of 0.1 μm-1500 μm.
[0070] The etching groove 14 extends along the surface of the P-type semiconductor layer 13 to the N-type semiconductor layer 11 .
[0071] The surface of the P-type semiconductor layer 13 is attached with a metal reflective layer 15 in ohmic contact with it.
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