Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate

A graphite substrate and lighting module technology, which is applied in the cooling/heating device of lighting devices, lighting devices, lighting and heating equipment, etc., can solve the problems that metal substrates cannot meet, and meet the production conditions for easy control, fast heat dissipation, and extended The effect of longevity

Inactive Publication Date: 2012-09-26
SHANXI SHANDI XINYUAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] LED lamps with high heat accumulation urgently need materials with high thermal conductivity to provide heat dissipation, and metal substrates cannot meet their needs

Method used

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  • Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate
  • Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate

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Embodiment 1

[0035] Put 100KG of finely ground graphite powder (particle size ≤0.9mm) with a carbon content of more than 99% into the acid treatment solution mixed with 50KG of sulfuric acid and 117KG of hydrogen peroxide, and soak for 120 minutes in a high temperature environment of 100±5°C . Then wash the acid-treated graphite powder to pH=5-6.5, put it into a graphite expansion furnace, expand it at a high temperature of 800-1000°C for 4 hours, and then slowly cool it down to room temperature. Take 70KG graphite powder obtained at high temperature, add 5KG copper powder, 5KG aluminum powder, 14KG silane coupling agent, 6KG titanate coupling agent, mechanically mix for 15-20 minutes, then heat knead for 15-20 minutes , the temperature is controlled at 80±5°C, and it is made into a paste. The resulting paste is cooled and crushed, and the crushed graphite compound is put into a graphite expansion furnace, expanded at a high temperature of 1000-1200°C for 1 hour, and then slowly cooled to...

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Abstract

The invention discloses a graphite base plate for an LED (light emitting diode) high-power illumination module and a manufacturing technology of the graphite base plate. The graphite base plate comprises a high heat-conduction graphite base layer, a heat-conduction insulation layer and a circuit layer. The heat-conduction graphite base layer is formed by the steps of sintering WT70 % of fine graphite powder, WT5 % of copper powder, WT5% of aluminium powder, WT14 % of silane coupling agent, WT6 % of titanate coupling agent under the condition of high temperature of 1000-1200 DEG C to obtain a graphite composite, and manufacturing the graphite composite into a high heat-conduction graphite sheet-shaped base material by graphite coiled material production equipment. The heat-conduction insulation layer is made from a ceramic-filled polymer. The circuit layer is manufactured by a copper foil with thickness being 35-280 Mu m through a PCB (printed circuit board) technology. The main component of the graphite base plate is carbon material which is easy and convenient to obtain, and therefore the graphite base plate is low in cost and has strong resistance to corrosion, acid and alkali, oxidation and aging; and the waste does not pollute environment.

Description

technical field [0001] The invention relates to the field of LED lamps, in particular to a graphite substrate used for LED high-power lighting modules and a manufacturing process thereof. Background technique [0002] The substrates of LED high-power lighting fixtures in the prior art are generally aluminum substrates or copper substrates, which are used as mounting circuit carriers for high-power LED light sources and as heat dissipation conduction for light sources. The aluminum base plate or copper base plate is actually a uniform temperature plate, which evenly dissipates the heat source, and then conducts it to other additional radiators installed on the back of the base plate. One of the main functions of the substrate is the circuit, and the other most important function is heat dissipation. [0003] The current substrate materials are mainly aluminum and copper. The thermal conductivity of copper is about 1.8 times that of aluminum (AL thermal conductivity: 200W / m*...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00C01B31/04F21Y101/02C01B32/225F21V29/85F21Y115/10
Inventor 杨诗毅刘荣
Owner SHANXI SHANDI XINYUAN TECH
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