Cured organopolysiloxane resin film having gas barrier properties and method of producing the same

A polysiloxane resin, polysiloxane technology, applied in the directions of transportation, packaging, textile, coating, etc., can solve the problems of poor gas barrier properties and water vapor barrier properties, and uneven adhesion of silicon oxynitride films.

Inactive Publication Date: 2012-10-03
DOW CORNING TORAY CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it was found that the silicon oxynitride layer, that is, the silicon oxynitride film was not uniformly adhered and was found to be poor in gas barrier properties such as water vapor barrier properties

Method used

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  • Cured organopolysiloxane resin film having gas barrier properties and method of producing the same
  • Cured organopolysiloxane resin film having gas barrier properties and method of producing the same
  • Cured organopolysiloxane resin film having gas barrier properties and method of producing the same

Examples

Experimental program
Comparison scheme
Effect test

example

[0277] Other examples are as follows:

[0278] (3) Organopolysiloxanes including organopolysiloxanes lacking organofunctional groups and comprising at least two silicon-bonded alkenyl groups per molecule, organopolysiloxanes comprising at least one organofunctional group per molecule and at least two silicon-bonded hydrogen atoms per molecule Combinations of siloxanes (excluding, however, combinations of organopolysiloxanes comprising two silicon-bonded alkenyl groups with organopolysiloxanes comprising two silicon-bonded hydrogen atoms) and hydrosilylation catalysts things, and

[0279] (4) Includes organopolysiloxanes comprising at least one organofunctional group and at least two silicon-bonded alkenyl groups per molecule, at least one organofunctional group and at least two silicon-bonded hydrogens per molecule Atomic organopolysiloxanes (however, excluding combinations of organopolysiloxanes containing two silicon-bonded alkenyl groups with organopolysiloxanes containing...

specific example

[0291] Specific examples of organopolysiloxanes lacking organofunctional groups and containing at least two silicon-bonded alkenyl groups per molecule are as follows:

[0292] Dimethylpolysiloxane end-blocked at both ends with dimethylvinylsiloxy groups,

[0293] A dimethylsiloxane-methylvinylsiloxane copolymer end-blocked at both ends with trimethylsiloxy groups,

[0294] A dimethylsiloxane-methylvinylsiloxane copolymer end-blocked at both ends with dimethylvinylsiloxy groups,

[0295] Methyltris(dimethylvinylsiloxy)silane,

[0296] Methylphenylpolysiloxane end-blocked at both ends with dimethylvinylsiloxy groups,

[0297] a dimethylsiloxane-methylvinylsiloxane copolymer end-blocked at both ends with dimethylphenylsiloxy groups, and

[0298] A dimethylsiloxane-methylvinylsiloxane-methylphenylsiloxane copolymer end-blocked at both ends with dimethylvinylsiloxy groups.

[0299] In addition, specific examples of component (A) are also applicable here.

[0300] Specific exampl...

Embodiment 1

[0565] The coating solution obtained in Synthesis Example 2 was spin-coated at 2500 rpm for 30 minutes onto the cured methyl phenyl vinyl film having a width of 10 cm, a length of 10 cm and a thickness of 100 μm obtained in the aforementioned Reference Example. One side of glass fiber reinforced membrane (A) made of polysiloxane resin. The 3-methacryloxy groups of poly(phenyl-co-3-methacryloxypropyl)silsesquioxane were polymerized with each other by exposing the coated side to UV radiation for 15 minutes using 200W Hg-Xe lamp, exposure dose is 30mW / cm 2 , and thereafter held at 150° C. for 120 minutes to cure the poly(phenyl-co-3-methacryloxypropyl)silsesquioxane.

[0566] A silicon oxynitride layer having a thickness of 30 nm, that is, a silicon oxynitride film was formed on the cured poly(phenyl-co-3-methacryloxypropyl)silsesquioxane layer by ion plating.

[0567] Using silica rods as the film-forming material, using N 2 Argon was used as the reaction gas, argon was used ...

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Abstract

A cured organopolysiloxane resin film having gas barrier properties comprising a fiber-reinforced film made of a hydrosilylation-cured organopolysiloxane resin and having a transparent inorganic layer selected from silicon oxynitride layer, silicon nitride layer, and silicon oxide layer formed on the fiber-reinforced film wherein a layer of cured organopolysiloxane that contains an organic functional group, silanol group, hydrosilyl group, or an organic group produced by the polymerization of polymerizable organic functional groups is interposed between said fiber-reinforced film and inorganic layer. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.

Description

technical field [0001] The present invention relates to a cured organopolysiloxane resin film exhibiting excellent gas barrier properties, wherein a transparent inorganic layer selected from the group consisting of a silicon oxynitride layer, a silicon nitride layer and a silicon oxide layer is formed on the cured On fiber reinforced membranes made of organopolysiloxane resins, the cured organopolysiloxane resins are transparent in the visible region. The present invention further relates to a method of producing such a cured organopolysiloxane resin film having excellent gas barrier properties. Background technique [0002] Film-type optical elements in which various polymer films are used as base materials are beginning to be used in, for example, organic EL displays and liquid crystal displays. In addition, as these displays become thinner and lighter, the importance of film-type optical components is increasing. Paper-type displays have become the subject of late, but ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/04C08J5/04
CPCC08J2383/04C09D183/04C08J5/24Y10T428/31663Y10T442/2098C08J5/244C08J5/249C08J5/04C08J5/18
Inventor 伊藤真树须藤通孝B·朱D·E·卡佐里斯L·赞伯夫
Owner DOW CORNING TORAY CO LTD
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