An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound
A resin composition, flexible printing technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problem of not being able to fully take into account the filling of concave parts and other characteristics, to meet the requirements of filling of concave parts, Effect of suppressing outflow and satisfying peel strength
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[0070] [Preparation of Adhesive Resin Composition and Production of Film Adhesive]
[0071] The adhesive resin composition of the present invention is produced by mixing the above-mentioned components (A) to (D) and additives if necessary, adding an organic solvent, and mixing using a ball mill, a homogenizer, or the like.
[0072] As the above-mentioned organic solvent, toluene, methanol, ethanol, isopropanol, acetone, dioxolane, hexane, triethylamine, isobutyl acetate, butyl acetate, ethyl acetate, methyl ethyl ketone (MEK), Methyl isobutyl ketone, cellosolve, ethylene glycol, dimethylformamide (DMF), xylene, N-methylpyrrolidone, etc.
[0073] The adhesive resin composition of the present invention having the above composition is used and stored as a film-like adhesive in a semi-cured state. Here, the semi-cured state is an adhesive state, and refers to a state in which part of the epoxy resin and the functional group-containing acrylic polymer in the adhesive resin composi...
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