An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound

A resin composition, flexible printing technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problem of not being able to fully take into account the filling of concave parts and other characteristics, to meet the requirements of filling of concave parts, Effect of suppressing outflow and satisfying peel strength

Inactive Publication Date: 2012-10-31
SUMITOMO ELECTRIC IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this regard, when the adhesives disclosed in Patent Documents 1 and 2 are applied to the hot roll metho

Method used

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  • An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound
  • An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound
  • An adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound

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[0070] [Preparation of Adhesive Resin Composition and Production of Film Adhesive]

[0071] The adhesive resin composition of the present invention is produced by mixing the above-mentioned components (A) to (D) and additives if necessary, adding an organic solvent, and mixing using a ball mill, a homogenizer, or the like.

[0072] As the above-mentioned organic solvent, toluene, methanol, ethanol, isopropanol, acetone, dioxolane, hexane, triethylamine, isobutyl acetate, butyl acetate, ethyl acetate, methyl ethyl ketone (MEK), Methyl isobutyl ketone, cellosolve, ethylene glycol, dimethylformamide (DMF), xylene, N-methylpyrrolidone, etc.

[0073] The adhesive resin composition of the present invention having the above composition is used and stored as a film-like adhesive in a semi-cured state. Here, the semi-cured state is an adhesive state, and refers to a state in which part of the epoxy resin and the functional group-containing acrylic polymer in the adhesive resin composi...

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Abstract

The invention provides an adhesive resin compound for a flexible printed wiring board and a flexible printed wiring board provided with a stiffening plate and employing the adhesive resin compound. The invention provides the adhesive resin compound for the flexible printed wiring board and a film adhesive which are capable of preventing projection on appearance in spite of a hot roller method and guaranteeing enough adhesive strength, the flexible printed wiring board being provided with the stiffening plate and employing the adhesive resin compound, and a manufacture method of the flexible printed wiring board. The adhesive resin compound for the flexible printed wiring board comprises: (A) crylic acid polymer A with the weight-average molecular weight (Mw) being higher than 100, 000 and lower than 900,000, (B) crylic acid polymer B with the Mw being between 1000-80000, (C) epoxy resin and (D) a curing agent. Preferably, the mass ratio (A:B) of the crylic acid polymer A and the crylic acid polymer B is 100:1 to 100:30.

Description

technical field [0001] The present invention relates to an adhesive resin composition for adhering a reinforcing board to a flexible printed wiring board (FPC) such as a flexible copper-clad laminate, and particularly relates to the above-mentioned flexible printed wiring board and reinforcing board Adhesive resin composition that can be passed between a pressing roll and a back-up roll (heat roll method) and a flexible printed wiring board with a reinforcing plate using the adhesive resin composition and methods of manufacture thereof. Background technique [0002] A flexible printed wiring board (FPC) is formed, for example, as follows: figure 1 As shown, a wiring pattern 3 obtained by etching a conductive foil such as copper foil is formed on a base film 2 such as polyimide, and a cover film 4 called a cover film 4 is further laminated on the wiring pattern 3 with an adhesive layer 5 interposed therebetween. Insulating film (usually polyimide film). figure 1 In the sho...

Claims

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Application Information

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IPC IPC(8): C09J133/00C09J133/08C09J163/00C09J7/00H05K1/02
Inventor 米泽隆幸改森信吾菅原润浅井省吾高见泽明木村淳
Owner SUMITOMO ELECTRIC IND LTD
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