Phosphorus diffusion method for crystal silicon wafer
A technology of crystalline silicon wafer and diffusion method, which is applied in the field of solar cells, can solve the problems of improving process conditions and increasing costs, and achieve the effects of relaxing matching conditions, increasing open circuit voltage, and reducing surface doping
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[0026] A phosphorus diffusion method for a crystalline silicon wafer, the steps comprising:
[0027] (1) Put the conventional monocrystalline 125 silicon wafer after texturing in a diffusion furnace, raise the temperature to 800 °C, and pass in phosphorus-carrying source nitrogen, dry oxygen and large nitrogen for the first constant source diffusion, and the diffusion time is 15 min ;The flow rate of phosphorus-carrying source nitrogen is 1.2L / min, the flow rate of dry oxygen is 0.9 L / min, and the flow rate of large nitrogen is 10 L / min;
[0028] (2) Stop feeding the phosphorus-carrying source nitrogen, raise the temperature to 900°C at a heating rate of 15°C / min, and feed dry oxygen and nitrogen at the same time to advance. The flow rate of dry oxygen is 1 L / min, and the The flow rate is 10 L / min, and the diffusion time is 26 min;
[0029] (3) Cool down to 830°C, and after the temperature stabilizes, the second constant source diffusion is carried out by introducing phosphor...
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