Double-layer composite micropunch sound absorption method and sound absorption panel

A double-layer composite and micro-perforation technology, which is applied in the direction of sound-generating devices and instruments

Inactive Publication Date: 2012-10-31
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practice, in order to ensure the structural strength, the material of the substrate is hard or thick, so it is difficult to process the hole diameter smaller than 0.5mm, thus limiting the width of its sound absorption frequency band
The thin film can achieve ultra-micro perforation processing, but because of its soft material, it cannot be used alone, which greatly limits its application range.

Method used

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  • Double-layer composite micropunch sound absorption method and sound absorption panel
  • Double-layer composite micropunch sound absorption method and sound absorption panel
  • Double-layer composite micropunch sound absorption method and sound absorption panel

Examples

Experimental program
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Effect test

Embodiment 1

[0044] The double-layer composite micro-perforated sound-absorbing structure is supported by two grooved columns 6, the backplane structure 7, the membrane support structure 8 and the micro-perforated substrate 9 are stuck between the grooved columns 6, and the two grooves are fixed by screws. Carry out lateral fixation on the four corners of column 6. The microperforated membrane 3 is adhered to a membrane support structure 8 . In use, the micro-perforated substrate 9 of the structure faces the direction of the sound source.

[0045] The purpose of this embodiment is to enable those skilled in the art to understand and implement the technical solutions of the present invention, and not to limit the protection scope of this patent. within the scope of protection of the invention.

[0046] The sound barrier provided by the present invention can also be made into other sizes, specifications and shapes that meet the requirements of the place of use, and it only needs to be inst...

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PUM

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Abstract

The invention provides a double-layer composite micropunch sound absorption method and a sound absorption panel. The panel in the thickness of 0.5-2mm is adopted to serve as a protective panel, holes are evenly arranged on the panel with the hole diameter of 0.5-1mm, punching rate is 1-10%, a second layer is a punching thin film with the thickness of about 0.1-0.3mm, the hole diameter is 0.1-0.2mm, and the punching rate is about 1-2%. A cavity is arranged between two layers, the thickness of the cavity is within 5cm, the two layers are matched to use to form double resonance effects, and a sound absorption frequency belt of a structure is effectively increased. The double-layer composite micropunch sound absorption method and the sound absorption panel solves the problem that base plate micropunch manufacture is difficult, and strength of thin film micropunch manufacture is insufficient though the thin film micropunch manufacture is simple. Simultaneously, the device is simple, simple and convenient to manufacture, light in thin shape, wide in application face, easy to wash and resisting to high temperature and has excellent weather fastness and environmental protection function.

Description

technical field [0001] The invention belongs to the field of acoustic technology, and specifically relates to a new non-fiber double-layer composite micro-perforated sound absorption method and structure, which can realize a sound absorption structure with excellent medium and low frequency sound absorption performance, weather resistance, environmental protection and light transmission, and belongs to the sound absorption structure. The field of noise reduction and environmental protection technology. Background technique [0002] The micro-perforated resonant sound-absorbing structure has achieved good sound-absorbing effects in many years of practice. It has a strict theory, does not require porous sound-absorbing materials, and can be used in harsh environments such as high temperature, high-speed airflow, humidity, and rot. At the same time, it has simple structure, convenient processing and transportation, reliable and convenient installation, and low cost. In practi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G10K11/168
Inventor 彭若龙陈颜王宏
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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