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Preparation method of high heat conductivity carbon fiber

A high thermal conductivity and fiber technology, applied in the fields of fiber chemical characteristics, textiles and papermaking, etc., can solve the problems of difficult preparation of bulk samples and batch production, harsh preparation conditions, application restrictions, etc., to achieve continuous production and easy Industrial continuous production, the effect of realizing industrial continuous production

Active Publication Date: 2014-12-03
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In these studies, in order to suppress the escape of a large amount of carbon-containing small molecular substances caused by the breakage of PI molecular chains during heat treatment, and reduce the defects in the film, it is necessary to apply extremely high pressure and very slow heating rate, and the preparation conditions are harsh.
This method is difficult to prepare bulk samples and produce in batches, and its application is greatly limited

Method used

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  • Preparation method of high heat conductivity carbon fiber
  • Preparation method of high heat conductivity carbon fiber

Examples

Experimental program
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Effect test

Embodiment 1

[0038] Use polyimide fibers composed of polymer chains whose imide groups are structural formula 1, the elongation at break is greater than 4% (such as 7-8%), and the strength is greater than 100Mpa (such as 150-200Mpa), and at the same time The axial preferred orientation degree of the polymer chain is greater than 60% (such as 70-80%). The two ends of these fibers are fixed (that is, the draft is 0), and they are placed in a heat treatment furnace for gas phase thermal stabilization. , from room temperature to 350°C at a rate of 5°C / min, then from 350°C to 500°C at a rate of 1°C / min, and stay for 30 minutes; Low-temperature carbonization treatment under high-purity nitrogen atmosphere, pressure 0.1005MPa, rising to 500°C at a rate of 10°C / min, then rising to 800°C at a rate of 2°C / min, and holding for 30 minutes. After cooling, both ends of the fiber were fixed, placed in a graphitization furnace, and graphitized under a high-purity argon atmosphere (2600°C, constant tempera...

Embodiment 2

[0040] Get the polyimide fiber that meets the requirements in Example 1, and the other conditions are the same as in Example 1, except that the graphitization temperature is increased to 3200 ° C, and the thermal conductivity of the resulting material reaches 391W m -1 ·K -1 , with a density of 1.96g / cm 3 .

Embodiment 3

[0042] Get the polyimide fiber that meets the requirements in Example 1, other conditions are the same as in Example 1, but apply 10% stretching in the stabilization process, and the graphitization temperature increases to 3000 ° C simultaneously, the thermal conductivity of the gained material 405W·m -1 ·K -1 , with a density of 2.05g / cm 3 .

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Abstract

The invention relates to a preparation method of high heat conductivity carbon fiber, which belongs to the technical field of manufacturing carbon fiber. The preparation method comprises the following steps of: firstly, performing vapor or liquid phase stabilizing processing on polyimide fiber, so that crosslinking solidification is realized on a polyimide polymer chain of the polyimide fiber; then performing carbonization on the stabilized fiber in nitrogen in a low temperature constraint condition; and finally, performing high temperature graphitization processing. The polyimide fiber is a linear polymer material, wherein an imide group has a highly preferred orientation along the fiber axis of the polymer chain. High heat conductivity GF (Glass Fiber) with high crystallinity and orientation can be obtained by using the preparation method disclosed by the invention.

Description

technical field [0001] The invention relates to a preparation method of high thermal conductivity carbon fiber, which belongs to the technical field of carbon fiber preparation. Background technique [0002] With the improvement of the quality of life, people have higher and higher requirements for the lightweight and miniaturization (thinness) of portable high-end entertainment electronic devices; at the same time, these electronic devices are also required to have higher performance and more functions. The requirements of these two aspects make the main components of these electronic equipment (such as CPU, etc.) more and more integrated, faster and faster, and smaller and smaller, thus generating more heat during operation, resulting in The overheating of the machine makes the user experience of these devices not good, frequent crashes or even damage. In order for each component of these devices to operate normally and efficiently, the heat must be directed and exported ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D01F9/24
Inventor 马兆昆宋怀河李卓
Owner BEIJING UNIV OF CHEM TECH
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