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Mold release film and method for manufacturing mold release film

A release film and release treatment technology, applied in chemical instruments and methods, electronic equipment, applications, etc., can solve the problems of reduced followability of substrate surface bumps, reduced flexibility, and barriers to electrode plating treatment, etc., to achieve Excellent effect of suppressing the outflow of adhesive, maintaining flexibility, and excellent followability

Active Publication Date: 2012-11-21
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, such heat treatment is performed at a high temperature and takes a long time, thus sometimes leading to an increase in cost
In addition, since the heat-treated release film has reduced flexibility as a whole, the followability (embedding property) to the unevenness of the substrate surface is reduced. Adhesive flows out to the electrode part of the flexible printed circuit board, which becomes an obstacle to the plating process of the electrode part, etc.

Method used

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  • Mold release film and method for manufacturing mold release film
  • Mold release film and method for manufacturing mold release film
  • Mold release film and method for manufacturing mold release film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0147] Polybutylene terephthalate (Novaduran 5010R5, manufactured by Mitsubishi Engineering Plastics, Inc., melting point: 224°C) as a crystalline aromatic polyester resin for the surface layer, and a linear polyolefin-based resin as the intermediate layer Low-density polyethylene (Excellen FX (CX5501), produced by Sumitomo Chemical Co., Ltd., melting point 66°C), ethylene-methyl methacrylate copolymer (Acryft (WH401), manufactured by Sumitomo Chemical Co., Ltd., melting point 86°C) and polypropylene (PS207A , manufactured by Sunallomer, melting point 160° C.), was put into a co-extrusion molding machine, and co-extruded with a T-die to obtain a film with a thickness of 10 μm in the surface layer and a thickness of 80 μm in the middle layer. In addition, the melting point was measured using a differential scanning calorimeter (DSC 2920, manufactured by TA Instruments).

[0148] Use a friction treatment device (abrasive treatment device, model YCM-150M, manufactured by Yamagata...

Embodiment 2~5

[0152] As shown in Table 1, except having changed the material and working energy (KJ) of the surface of a rubbing process material, it carried out similarly to Example 1, and obtained the release film.

[0153] The obtained release film was observed with a transmission electron microscope (TEM) (Model H-9500, manufactured by Hitachi High-Tech Co., Ltd.) to observe the cross section cut in the thickness direction using a slide microtome (Model SM2000R, manufactured by Ikeda Rika Co., Ltd.) , the mold release treatment layer was observed only in the region from the surface of the surface layer to the thickness (nm) shown in Table 1. The image observed by a transmission electron microscope in Example 2 is shown in Figure 5 , the image observed by a transmission electron microscope in Example 3 is shown in Figure 6 , the image observed by a transmission electron microscope in Example 5 is shown in Figure 7 . In addition, the crystallinity (%) of the surface layer was calcul...

Embodiment 6

[0161] Polybutylene terephthalate (Novaduran 5010R5, manufactured by Mitsubishi Engineering Plastics, Inc., melting point: 224°C) as a crystalline aromatic polyester resin for the surface layer, and a linear polyolefin-based resin as the intermediate layer Low-density polyethylene (Excellen FX (CX5501), produced by Sumitomo Chemical Co., Ltd., melting point 66°C), ethylene-methyl methacrylate copolymer (Acryft (WH401), manufactured by Sumitomo Chemical Co., Ltd., melting point 86°C) and polypropylene (PS207A , manufactured by Sunallomer, melting point 160° C.), was put into a co-extrusion molding machine, and co-extruded with a T-die to obtain a film with a thickness of 10 μm in the surface layer and a thickness of 80 μm in the middle layer. In addition, the melting point was measured using a differential scanning calorimeter (DSC 2920, manufactured by TA Instruments).

[0162] Use a rubbing treatment device (abrasive treatment device, model YCM-150M, manufactured by Yamagata ...

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Abstract

Disclosed is a mold release film, which has excellent mold releasability and excellent conforming characteristics to the substrate surface, and which can suppress flow out of an adhesive in heat press molding. The mold release film has a surface layer, and a mold release layer is observed only in a region within a thickness of 50-300 nm from the surface of the surface layer.

Description

technical field [0001] The present invention relates to a mold release film having excellent mold release properties, excellent followability to a substrate surface, and capable of suppressing the outflow of an adhesive during thermocompression molding. Background technique [0002] In the manufacturing process of printed wiring boards, flexible printed circuit boards, multilayer printed wiring boards, etc., release films are used when hot-pressing copper-clad laminates or copper foils on substrates with prepregs or heat-resistant films interposed . In addition, in the manufacturing process of the flexible printed circuit board, when the cover film is thermocompression bonded to the flexible printed circuit board body on which the copper circuit is formed with a thermosetting adhesive or a thermosetting adhesive sheet, in order to prevent covering Bonding occurs between the film and the hot press plate, and a release film is also widely used. [0003] For the release film,...

Claims

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Application Information

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IPC IPC(8): B32B27/00B32B27/36H05K3/28
CPCB32B15/08B32B27/36B32B27/32B32B15/20B32B7/12B32B2264/102B32B2264/104B32B2307/306B32B2307/538B32B2307/704B32B2307/732B32B2457/08B32B7/06H05K3/28
Inventor 中尾洋祐松本弘丈五藤靖志土谷雅弘
Owner SEKISUI CHEM CO LTD