High-temperature-resistant heat-seal adhesive applied to medicinal aluminum foil packaging
A high-temperature-resistant technology, applied in the field of heat-sealing adhesives, can solve problems such as containing harmful substances, producing harmful substances, and drug pollution, and achieves good safety effects
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Embodiment 1
[0014] Example 1 The high-temperature-resistant heat-sealing adhesive applied to pharmaceutical aluminum foil packaging is made of the following raw materials:
[0015] Ethyl acetate (EA) 100kg, methyl ethyl ketone (MEK) 100kg, butyl acetate (BA) 16kg, polyurethane resin (PU) for ink 120kg, (VMCH) 64kg.
[0016] The specific preparation method is as follows: measure ethyl acetate, butyl acetate, and butanone according to the stated ratio, add them to the reaction kettle in turn, stir at 65°C for 30 minutes, add chlorine wax and continue stirring, and add polystyrene after the chlorine wax is completely infiltrated and dissolved for 30 minutes. ester, stop stirring after 2 hours, and discharge it for use after the foam completely disappears.
[0017] Performance indicators of the above high temperature resistant heat sealant:
[0018] Solid content: 25±1% (180°C for 10 seconds) (tested according to the national standard test method);
[0019] Fineness: ≤50 centipoise;
[002...
Embodiment 2
[0023] Example 2 The high-temperature resistant heat-sealing adhesive applied to pharmaceutical aluminum foil packaging has the following raw material composition:
[0024] 28% ethyl acetate, 22% methyl ethyl ketone, 5% butyl acetate, 27% polyurethane resin for ink, and 18% vinyl chloride. The preparation method is the same as in Example 1.
[0025] Performance indicators of the above high temperature resistant heat sealant:
[0026] Solid content: 25.5±1% (180°C for 10 seconds);
[0027] Fineness: ≤50 centipoise;
[0028] Viscosity: 17±2 seconds / 25℃;
[0029] Appearance: light yellow transparent liquid;
[0030] Heat-sealing strength: ≥7.9 Newton (test sample 15×200mm, heat-sealing temperature 150°C, pressure 2kg, time 1s).
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