Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of charge trapping non-volatile memory

A manufacturing method and charge trapping technology, applied in the field of microelectronics, can solve the problems of increasing the leakage probability of the memory and deteriorating the performance of the memory, and achieve the effects of suppressing the deterioration of the memory performance, avoiding the crystallization problem, and reducing the manufacturing cost.

Active Publication Date: 2012-11-28
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high dielectric constant semiconductor materials generally crystallize at high temperatures, thereby increasing the leakage rate of the memory and deteriorating the performance of the memory.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of charge trapping non-volatile memory
  • Manufacturing method of charge trapping non-volatile memory
  • Manufacturing method of charge trapping non-volatile memory

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0042] The processing method of the present invention can be widely used in various fields, and can utilize many suitable materials to make, and the following is to illustrate by specific embodiment, certainly the present invention is not limited to this specific embodiment, in this field Common replacements known to those of ordinary skill undoubtedly fall within the protection scope of the present invention.

[0043] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the general scale, which should not be u...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a manufacturing method of a charge trapping non-volatile memory. The method comprises the following steps of: forming an active region and a channel region of a device on a semiconductor substrate through shallow-trench isolation; forming a multi-stack gate medium layer comprising a tunneling layer, a charge storage layer and a barrier layer on the substrate by combining the low-temperature chemical vapor deposition and atomic layer deposition technology, and forming a pattern through photoetching; forming a side wall and a mask layer of the gate medium layer by a low-temperature chemical vapor deposition and photoetching method; forming a source / drain region and an expansion region thereof through ion implantation, and activating by laser; forming a gate electrode on the gate medium layer, and depositing a polycrystalline silicon medium at the upper layer of the gate electrode to form a multi-gate electrode layer; executing the isolation and encapsulation operations of the gate structure by a low-temperature chemical vapor deposition method; and leading out the gate, source and drain electrodes through metal interconnection. Through the invention, the heat budget in the memory manufacturing process can be reduced, and the crystallization problem of the thin-film medium layer of a high-dielectric constant material is inhibited.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a method for manufacturing a charge-trapping non-volatile memory. Background technique [0002] The current microelectronics products are mainly divided into two categories: logic devices and storage devices, and storage devices are needed in almost all electronic products today, so storage devices occupy a very important position in the field of microelectronics. [0003] Storage devices can generally be classified into volatile memories and non-volatile memories. The main feature of non-volatile memory is the ability to retain stored information for a long period of time without power on. It not only has the characteristics of read-only memory (ROM), but also has high access speed, and is easy to erase and rewrite, and consumes less power. With the demand for large-capacity and low-power storage in multimedia applications and mobile communications, the market share o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/8247H01L21/285
Inventor 刘明王晨杰霍宗亮张满红王琴刘璟谢常青
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products