Light-emitting diode (LED) packaging structure and silver plating substrate
A technology for LED packaging and substrates, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of inability to perform optical processing, the substrate circuit cannot be changed, and the thermal conductivity is not good enough to improve light efficiency and heat dissipation. , increase refraction, improve the effect of focusing effect
Active Publication Date: 2015-05-27
XIAMEN LANGXING ENERGY SAVING LIGHTING
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Problems solved by technology
The problem with this process is that, firstly, because the substrate of the substrate is copper foil, the copper foil can be well energized but cannot be well optically processed, and the light efficiency can only be around 100Lm / w; secondly, the substrate circuit The structure of the package is fixed and cannot be changed, and the power of each light source can only be changed by changing the type of LED chip; again, the LED light source in this package has no thermoelectric isolation, the thermal conductivity is not good enough, and the optical structure is unscientific
Method used
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[0021] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.
[0022] Please also refer to figure 1 , figure 2 , for convenience of description, the present invention takes the LED package structure of 6 crystal-bonding cups as an example for illustration. In other embodiments, the number of crystal-bonding cups is designed according to needs, without departing from the protection scope of the present invention. The LED packaging structure 100 includes a silver-plated substrate 10 , a crystal-bonding cup 20 disposed on the silver-plated substrate 10 , an insulating medium layer 30 and an LED chip 40 fixed in the crystal-bonding cup 20 .
[0023] The silver-plated substrate includes an electro-silver layer 11 , a galvanized layer 12 , an aluminum plate layer 13 , an insulating layer 14 and a heat dis...
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The invention discloses a light-emitting diode (LED) packaging structure which comprises a silver plating substrate, a die bond cup, an insulating dielectric layer and an LED wafer which is fixed in the die bond cup, wherein the die bond cup is arranged on the silver plating substrate; the silver plating substrate sequentially comprises a silver plate layer, a galvanization layer, an aluminum plate layer, an insulating layer and a radiating metal layer from top to bottom; the silver plate layer, the galvanization layer and the aluminum plate layer form a circuit layer; the aluminum plate layer is segmented into a block shape by the insulating dielectric layer; two poles of the LED wafer are respectively connected with the circuit layer through a metal line; the die bond cup is filled by a silica gel layer; and the LED wafer is packaged in the die bond cup by the silica gel layer. The invention also discloses an LED packaging structure.
Description
technical field [0001] The invention relates to an LED packaging structure and a silver-plated substrate thereof. Background technique [0002] The Chip On Board (COB) process transfers and mounts the semiconductor chip on the printed circuit board. The electrical connection between the chip and the substrate is realized by wire stitching and covered with resin. The problem with this process is that, firstly, because the substrate of the substrate is copper foil, the copper foil can be well energized but cannot be well optically processed, and the light efficiency can only be around 100Lm / w; secondly, the substrate circuit The structure of the package is fixed and cannot be changed, and the power of each light source can only be changed by changing the type of LED chip; again, the LED light source in this package has no thermoelectric isolation, the thermal conductivity is not good enough, and the optical structure is unscientific. Contents of the invention [0003] The t...
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IPC IPC(8): H01L33/48H01L33/62H01L33/64H05K1/00
CPCH01L2224/48091
Inventor 白鹭明庞立勋肖春
Owner XIAMEN LANGXING ENERGY SAVING LIGHTING