Pressure-sensitive adhesive printed circuit forming method

A technology of printed circuit and molding method, applied in the field of conductive powder molding circuit, can solve the problems of high cost and low-cost large-scale application, and achieve the effects of being conducive to recycling, excellent folding resistance, and low cost

Inactive Publication Date: 2012-12-19
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
View PDF3 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large amount of precious metals used in this method, the cost of the product is relatively high, which does not meet the requirements of low-cost large-scale applications.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Print the pressure-sensitive adhesive target circuit composed of solvent-based pressure-sensitive adhesive on the coated paper substrate by screen printing;

[0028] 2) Put the coated paper substrate into an oven at 80°C for 10 minutes to dry, and take it out after the target line of the pressure-sensitive adhesive is completely dry;

[0029] 3) After the pressure-sensitive adhesive target line is dry, sprinkle conductive powder on the pressure-sensitive adhesive target line, so that the pressure-sensitive adhesive target line is fully covered by conductive powder, and a conductive powder layer is formed on the pressure-sensitive adhesive target line; The body is silver flake powder, and the diameter of the silver flake is 30-50μm;

[0030] 4) Use a suction fan to suck the excess silver flake powder away from the printing substrate and recycle it;

[0031] 5) Put the printing substrate on the press to pressurize, and compact the conductive powder layer (silver powde...

Embodiment 2

[0034] 1) Print the target circuit pattern on the PET film substrate, the printing method is letterpress printing, and the printing material is UV-curable pressure-sensitive adhesive;

[0035] 2) Use a UV lamp to irradiate the reverse side of the printing substrate until the pressure-sensitive adhesive is completely cured;

[0036] 3) Sprinkle an excessive amount of mixed powder of copper flakes and silver nanowires on the printed pattern, the mass ratio is 3:1, so that the powder can fully cover the printed pattern; the diameter of copper flakes is 50-100 μm, and the diameter of silver nanowires is 100-200nm, length 20-30μm.

[0037] 4) Use a suction fan to suck the excess mixed powder away from the substrate and recycle it, then only the mixed powder on the printed target circuit pattern will be stuck.

[0038] 5) Put the matrix into the press for pressurization, the pressure is 20MPa, and compact the powder layer.

[0039] 6) Spray a UV-curable acrylate coating on the pow...

Embodiment 3

[0041] 1) Print the target circuit pattern on the glass fiber reinforced epoxy resin board substrate, the printing method is pad printing, and the printing material is water-based pressure-sensitive adhesive.

[0042] 2) Place the substrate at room temperature for 30 minutes to completely dry the water-based pressure-sensitive adhesive.

[0043] 3) Sprinkle an excessive amount of mixed powder of graphene and carbon nanotubes on the printed pattern, the mass ratio is 1:1, so that the powder can fully cover the printed pattern; the average diameter of graphene is 10 μm, and the diameter of carbon nanotubes is 40 μm. -50nm with a length of 15-20μm.

[0044] 4) Use a suction fan to suck the excess powder away from the substrate and recycle, then only the powder at the printed pattern is stuck and remains on the substrate.

[0045] 5) Put the matrix into the press for pressurization, the pressure is 50MPa, and compact the powder.

[0046] 6) Brush the silicone coating on the circ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a pressure-sensitive adhesive printed circuit forming method which includes steps of printing a pressure-sensitive adhesive target circuit consisting of pressure-sensitive adhesive on a printed substrate; placing the printed substrate with the pressure-sensitive adhesive target circuit into an oven or at the normal temperature until the pressure-sensitive adhesive target circuit is dried completely; spreading conductive powder onto the pressure-sensitive adhesive target circuit to cover the same completely so as to form a conductive powder layer on the pressure-sensitive adhesive target circuit after the pressure-sensitive adhesive circuit is dried; removing residual conductive powder on the printed substrate by blowing or sucking and recovering the residual conductive powder; pressurizing the printed substrate on a press machine to compact the conductive powder on the pressure-sensitive adhesive target circuit; and coating a protective layer on the conductive powder layer to obtain a pressure-sensitive adhesive circuit. The pressure-sensitive adhesive printed circuit forming method has the advantages that production process is clean and environment-friendly, environment-friendly base materials can be adopted, production efficiency is high, cost is low and the like.

Description

Technical field: [0001] The invention relates to a method for forming a circuit, in particular to a method for forming a circuit by using conductive powder after printing graphics through pressure-sensitive adhesive. technical background: [0002] As an important part of electronic products, circuit boards are increasingly in demand in modern life. The circuit board is made into a rigid board or a flexible flexible board according to different application environment requirements. At present, the widely used production processes are etching method and silver paste printing method. The etching method is to perform a "subtraction" operation on the metal-clad plate, that is, to corrode the unnecessary parts outside the target circuit with a corrosive solution to form a conductive circuit. The "subtraction" operation will cause waste of metal and form metal ion pollution. The etching method also has the disadvantage that the selection of the substrate is limited to a certain ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10
Inventor 付绍云黄贵文
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap