Welding method of shielding cover and electronic circuit board

Abstract

The invention provides a welding method of a shielding cover and an electronic circuit board, which relates to a welding technique of devices. The welding method comprises the following steps that 1, the shielding cover is processed by a backflow furnace independently; 2, solder paste is printed on the electronic circuit board; 3, the shielding cover is subjected to surface mounting to the electronic circuit board; and 4, the electronic circuit board mounted with the shielding cover is processed by the backflow furnace. The temperature of the backflow furnace for processing the shielding cover independently in Step 1 is the same as the temperature of the backflow furnace for processing the electronic circuit board mounted with the shielding cover in Step 4. According to the welding method, warping of the electronic circuit board when being processed by the backflow furnace is avoided while materials of the shielding cover or the electronic circuit board are not required to be changed, the production cost can be lowered effectively, and the method reduces the material consumption effectively, and therefore reduces the energy consumption.

Description

【Technical field】 [0001] The invention relates to the technical field of device welding, in particular to a welding method for a shielding cover and an electronic circuit board. 【Background technique】 [0002] With the rapid development of electronic technology, the calculation speed of each electronic unit in the circuit board is getting faster and faster, and the clock frequency of each signal on the electronic circuit board is also getting higher and higher. Therefore, in order to better reduce the mutual influence between the units, in In the design, it is more and more common to use metal shielding covers to shield the lines of each unit. [0003] However, since current circuit boards are designed for the purpose of shielding electromagnetic interference, problems related to the production process have not been taken into consideration, so the existing design of solder shielding covers on electronic circuit boards has the following disadvantages: [0004] Regardless of...

AI Technical Summary

Problems solved by technology

The stress of the shielding cover is large, and the thermal conductivity of the shielding cover is quite different from that of the electronic circuit board, and the temperature of the shielding cover rises faster, which will cause the shielding cover to warp first, resulting in the arc warping of the middle part of the four sides, so The deformation of the shielding cover is more likely to affect the deformation of the electronic circuit board. After the furnace passes through the furnace, a superimposed deformation effect is formed, which can easily cause the deformation of the electronic circuit board, thereby affecting the shape and structure of the electronic circuit board and causing false soldering of other devices.

[0005] In order to solve the deformation, the more common method at present is to use materials with less deformation at high temperature. However, the price of such materials is high, which leads to an increase in production costs.

In addition, the method of increasing the thickness of the shielding cover can also be used to solve the deformation, but this method will cause waste of shielding cover materials and increase the thickness of the electronic circuit board, which will increase the thickness of the product, thereby affecting the appearance of the product

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