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Method for preparing stereolithography rapid-prototyping photosensitive resin by adopting 1,4-cyclohexanedimethanol diglycidyl ether diacrylate as prepolymer

A technology of diglycidyl ether and cyclohexanedimethanol, which is applied in the field of preparation of stereolithography rapid prototyping photosensitive resin, achieves the effects of simple steps, good photosensitivity and good mechanical properties

Inactive Publication Date: 2013-03-06
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in these published papers and authorized patents, the acrylate prepolymers used in the preparation of photosensitive resins are also mainly bisphenol A type epoxy acrylates. For the application of 1,4-cyclohexanedimethanol Glyceryl ether diacrylate as a photosensitive resin prepolymer for stereolithography rapid prototyping has not been involved

Method used

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  • Method for preparing stereolithography rapid-prototyping photosensitive resin by adopting 1,4-cyclohexanedimethanol diglycidyl ether diacrylate as prepolymer

Examples

Experimental program
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Effect test

Embodiment 1

[0026] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, bisphenol A type epoxy resin (E-51) 500 grams, 1,4-cyclohexanedimethanol diglycidyl ether diacrylate 730 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams.

[0027]2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.1mJ / cm 2 .

[0028] critical exposure E c The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0029] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment manufactured by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a powe...

Embodiment 2

[0033] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 1,4-cyclohexanedimethanol diglycidyl ether diacrylate 800 grams, 2-hydroxy-2-methyl-1-phenyl-1-propanone 110 grams, triarylsulfonium hexafluoroantimonic acid Salt 190 g.

[0034] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.9 mJ / cm 2 .

[0035] 3. Some test pieces were made by using SLA-3500 UV laser curing rapid prototyping equipment, and then these test pieces were post-cured for 90 minutes in a UV box with a power of 500 mW. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.

[0036] 4. Using SLA-3500 UV laser curing rapid prototyping equipment, some test pieces were made according to ASTM D638 and ASTM D256 standards, and then post-cur...

Embodiment 3

[0038] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 500g, bisphenol A type epoxy resin (E-51) 900g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, 1,4-cyclohexanedimethanol diglycidyl ether diacrylate 900 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 200 grams.

[0039] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.3mJ / cm 2 .

[0040] 3. Some test pieces were made by using SLA-3500 UV laser curing rapid prototyping equipment, and then these test pieces were post-cured for 90 minutes in a UV box with a power of 500 mW. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.

[0041] 4. Using SLA-3500 UV laser curing rapid prototyping equipment, some test pieces were made according to ASTM D638 and ASTM D256 standards, and then post-cured for 90 minutes in a UV ...

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Abstract

The present invention discloses a method for application of 1,4-cyclohexanedimethanol diglycidyl ether diacrylate as an acrylate prepolymer in stereolithography rapid-prototyping photosensitive resin preparation. The prepared photosensitive resin mainly comprises the following raw material components, by mass, 15-65 parts of 1,4-cyclohexanedimethanol diglycidyl ether diacrylate, 5-55 parts of an epoxy resin, 5-55 parts of trimethylene oxide, 1-12 parts of a cation type photopolymerization initiator, and 1-10 parts of a free radical type photopolymerization initiator. The prepared photosensitive resin has good photosensitivity and a critical exposure amount Ec of less than 16.0 mJ / cm<2>. After the photosensitive resin is subjected to stereolithography prototyping, precision of the prototyping part is high, a buckling factor CF (6) of the prototyping part is within a range of +-0.01, and CF (11) of the prototyping part is within a range of +-0.03. With the prepared photosensitive resin, parts with any complex shapes and high precision can be directly manufactured. In addition, the 1,4-cyclohexanedimethanol diglycidyl ether diacrylate has characteristics of moderate viscosity, low odor and good cured product flexibility, such that the 1,4-cyclohexanedimethanol diglycidyl ether diacrylate can be adopted as an acrylate prepolymer to replace a bisphenol A type epoxy acrylate to be applied in stereolithography rapid-prototyping photosensitive resin prepartion.

Description

technical field [0001] The present invention relates to a method for preparing stereolithography rapid prototyping photosensitive resin, in particular to a method for preparing stereolithography rapid prototyping photosensitive resin with 1,4-cyclohexanedimethanol diglycidyl ether diacrylate as a prepolymer and applications. Background technique [0002] Stereolithography rapid prototyping is the earliest rapid prototyping technology. It is based on the principle of physical layered manufacturing, using photosensitive resin as raw material, and scanning point by point along the layered section with an ultraviolet laser under the control of CNC, so that the thin layer of resin in the scanning area undergoes photopolymerization and solidifies, thus forming a part of the product. The cross-sectional thin layer, in conjunction with the vertical linkage of the workbench, scans the next layer of resin, and the newly cured layer is firmly bonded to the previous layer, so that it i...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/20C08F283/10C08F2/48
Inventor 黄笔武程桂亮周宽邓冲谌伟庆孙韡邹怀华
Owner NANCHANG UNIV
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