Semiconductor component and manufacturing method thereof
A manufacturing method and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid device manufacturing, semiconductor/solid device components, etc., can solve the problem of long distance between semiconductor chips and passive components, increase of parasitic capacitance, inductance, resistance, The impact of electrical performance and other issues can be achieved to achieve flexible impedance matching design, improve the matching degree, and improve the effect of electrical properties
Active Publication Date: 2013-03-06
INNOGRATION SUZHOU
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Problems solved by technology
[0004] However, this method makes the distance between the semiconductor chip and the passive element too long, increases additional parasitic capacitance, inductance, and resistance, reduces the matching degree of impedance, and affects the electrical performance of the semiconductor device.
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[0034] As mentioned in the background technology, it is still impossible to integrate large-value passive components on semiconductor chips in the prior art, so in some high-power high-frequency devices, passive components need to be fabricated on printed circuit boards, but this way The lead distance between the passive component and the semiconductor chip is too long, which brings additional parasitic capacitance, inductance, and resistance, affects the impedance matching between the semiconductor chip and the printed circuit board, and reduces the electrical properties of the device.
[0035] In order to solve the above problems, the present invention integrates surface mount components on the mounting flange on the basis of traditional semiconductor components, and utilizes passive components formed by surface mount components to achieve impedance matching with low stray inductance and low loss, and improve the electrical performance of the device. At the same time, the cos...
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The invention discloses a semiconductor component. According to the semiconductor component, a passive element formed by a surface mounting element and an active element in a semiconductor chip are integrated on a mounting flange; and the conventional semiconductor passive element is substituted through the surface mounting element, so that the distance from the passive element to the active element is short as much as possible, thereby reducing the parasitic resistance, capacitance and resistance and improving the matching degree of impedance. In addition, since the passive element in the surface mounting element can form extremely large capacitance, inductance or resistance under the condition of extremely small volume, the impedance matching design in a high-power device can be more flexible, the Q value of the device is favorably increased, and the loss is reduced compared with the passive element under the semiconductor process. Meanwhile, the invention also discloses a manufacturing method of the semiconductor component.
Description
technical field [0001] The invention relates to the field of semiconductor device production, in particular to a semiconductor component including surface mount components and a manufacturing method thereof. Background technique [0002] In some high-power high-frequency semiconductor devices, such as radio frequency (RF) device modules, when the semiconductor chip is connected to the printed circuit board, in order to improve the efficiency value (Q) of the device, it is often necessary to connect the semiconductor chip and the printed circuit board. Introduce some passive components (such as capacitors, inductors, resistors) between them, so as to improve the impedance matching degree of semiconductor chips and printed circuit boards. [0003] Limited by the semiconductor manufacturing process and the nature of the semiconductor material itself, integrating passive devices on the semiconductor chip will increase the volume of the entire semiconductor chip, especially when ...
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Login to View More IPC IPC(8): H01L23/498H05K1/18H01L23/64H05K3/30H01L21/50
CPCH01L2224/48091H01L2224/49175H01L2924/3011H01L2924/30111H01L2924/00014H01L2924/00
Inventor 马强石秋明
Owner INNOGRATION SUZHOU