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Composite board, metamaterial and preparation methods

A composite board and metamaterial technology, applied in chemical instruments and methods, special decorative structures, decorative art, etc., can solve the problems of pollution, high cost of electroplating copper plating, etc., and achieve the effects of cost reduction, low cost, and small dielectric loss

Active Publication Date: 2013-03-13
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the existing problems of high cost and serious pollution of electroplating copper plating, and provide a two-step processing method using a hot roller press to coat the surface of polystyrene substrate with metal foil to prevent Defects that lead to wrinkling of the metal foil too quickly to obtain a metamaterial composite plate with a flat surface

Method used

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  • Composite board, metamaterial and preparation methods
  • Composite board, metamaterial and preparation methods
  • Composite board, metamaterial and preparation methods

Examples

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preparation example Construction

[0037] A preparation method for a composite board, comprising the following steps, such as figure 1 shown.

[0038] S1. Cover the polystyrene substrate with hot melt adhesive and / or the lower surface, put it into a hot roller press and heat press to form a pre-pressed substrate; the hot melt adhesive is preferably TPU hot melt adhesive, PU hot melt adhesive, PO hot melt Glue or EVA hot melt glue. Preferably, the hot pressing temperature in step S1 is 80-280°C. Preferably, the rolling pressure in step S1 is 2 ~ 30kg / cm 2 . Preferably, the rolling speed in step S1 is 2-30 min / m.

[0039] S2. Coating metal foil on the pre-pressed substrate and / or the lower surface to form a pre-pressed composite board; the metal foil is copper foil, silver foil or aluminum foil, and of course other available metal foils are also available. Preferably, the metal foil has a thickness of 0.005-0.15 mm.

[0040] S3. Put the pre-pressed composite board into a hot roller press, and heat-press to ...

Embodiment 1

[0044] S1. Cover the polystyrene substrate and / or the lower surface with EVA hot melt adhesive and put it into a hot roller press to form a pre-pressed substrate; the hot pressing temperature is 121°C and the rolling pressure is 20kg / cm 2 , The rolling speed is 1.1m / min;

[0045] S2. Cover the upper and / or lower surface of the pre-pressed substrate with copper foil with a thickness of 0.02 mm to form a pre-pressed composite board;

[0046] S3. Put the pre-pressed composite board into a hot roller press and heat press it to form a supermaterial composite board. The hot pressing temperature is 121°C and the rolling pressure is 20kg / cm 2 , The rolling speed is 1.1m / min.

[0047] The composite board obtained in Example 1 was tested by a peel strength tester (IPC-TM-650), and the peel strength was 1.8Kgf / cm.

Embodiment 2

[0049] S1. Cover the polystyrene substrate and / or the lower surface with EVA hot melt adhesive and put it into a hot roller press to form a pre-pressed substrate; the hot pressing temperature is 100°C and the rolling pressure is 15kg / cm 2 , The rolling speed is 2m / min;

[0050]S2. Cover the upper and / or lower surface of the pre-pressed substrate with copper foil with a thickness of 0.02 mm to form a pre-pressed composite board;

[0051] S3. Put the pre-pressed composite board into a hot roller press and heat press to form a supermaterial composite board. The hot-pressing temperature is 140°C and the rolling pressure is 20kg / cm 2 , The rolling speed is 3m / min.

[0052] The composite board obtained in Example 2 was tested by a peel strength tester (IPC-TM-650), and the peel strength was 1.7Kgf / cm.

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Abstract

The invention provides a preparation method of a composite board. The preparation method comprises the following steps: S1. coating hot melt adhesives on the upper and / or lower surface of a polystyrene substrate and putting the polystyrene substrate into a hot roller press to be hot-pressed to form a pre-pressed substrate; S2. coating metal foils on the upper and / or lower surface of the pre-pressed substrate to form a pre-pressed composite board; and S3. putting the pre-pressed composite board into the hot roller press to be hot-pressed to form the composite board, wherein the hot-press temperature is 121-280 DEG C. The preparation method has the beneficial effects that the processing method for coating the metal foils (such as copper foils) on the polystyrene substrate by using the hot-pressing mode of the hot roller press in two steps cannot cause wrinkling of the metal foils due to too fast cooling and the metamaterial composite board with smooth surface is obtained; and the processing method is conductive to simplifying the production process and reducing the cost and is pollution-free and the metal foil coating bonding force meets the processing requirement of a metamaterial, so the metamaterial composite board can be widely applied in the field of the metamaterial processing.

Description

【Technical field】 [0001] The invention relates to the field of artificial electromagnetic materials, in particular to a composite plate, a preparation method of the composite plate, a preparation method of a supermaterial and the supermaterial. 【Background technique】 [0002] Metamaterials refer to some artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the ordered design of the structure on the key physical scale of the material, it is possible to break through the limitations of some natural laws of the surface, so as to obtain the supernormal material function beyond the ordinary properties inherent in nature. The properties and functions of metamaterials are realized by the matrix material and the artificially designed metal microstructure. [0003] The current metamaterials are mainly realized by making metal wires on thermosetting glass fiber reinforced polymer resin-based copper cl...

Claims

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Application Information

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IPC IPC(8): B32B15/082B32B7/12B32B37/06B32B37/10B32B37/12B44C5/04
Inventor 刘若鹏季春霖黄新政
Owner KUANG CHI INST OF ADVANCED TECH
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