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Coating composition and applications thereof

A composition and coating technology, applied in coatings, plastic/resin/wax insulators, devices for coating liquids on surfaces, etc. problems such as poor coating, to achieve the best coating uniformity, good reworkability and adhesion

Active Publication Date: 2013-03-27
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent publication solves the problem that the coating film formed by general coatings has poor adhesion to the substrate after long-term use, and at the same time leads to poor insulation of electronic products.
[0006] However, the above-mentioned insulating coatings all have the problem of poor coating uniformity in use, and the reworkability of the coating film after coating is not good, resulting in damage to electronic components when the coating film is removed, or Poor adhesion of the coating film after coating, resulting in failure to adhere to the substrate

Method used

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  • Coating composition and applications thereof
  • Coating composition and applications thereof
  • Coating composition and applications thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0033] The synthesis method of the block copolymer (A) of the present invention comprises the following steps: (1) polymerization reaction, respectively dissolving the vinyl aromatic monomer and the conjugated diene monomer in an organic solvent, and then Adding a polymerization initiator to carry out anionic polymerization to form a block copolymer precursor; and (2) hydrogenation reaction, performing a hydrogenation reaction on the block copolymer precursor in the presence of a hydrogenation catalyst to obtain the block copolymer precursor of the present invention Copolymer (A).

[0034] (1) Polymerization reaction:

[0035] When preparing the block copolymer, preferably, the vinyl aromatic monomer and / or the conjugated diene monomer can be diluted with an organic solvent to an appropriate concentration, and then mixed and polymerized. In a specific embodiment of the present invention, the diluted concentration is 25% by weight.

[0036] Preferably, the organic solvent is ...

Synthetic example 1

[0079] Under nitrogen ambient gas, will contain the cyclohexane solution of the styrene (styrene) of 15 weight parts, the n-butyllithium of 0.13 weight part, and the tetramethylethylenediamine of 0.05 weight part [randomization agent (randomizer (randomizer) )] placed in an autoclave with a stirrer, and polymerized at a temperature of 70° C. for 20 minutes. Next, a cyclohexane solution containing 70 parts by weight of 1,3-butadiene was added to the autoclave over 50 minutes, and a polymerization reaction was performed at 70° C. for 5 minutes. Next, a cyclohexane solution containing 15 parts by weight of styrene was added, and a polymerization reaction was performed at 70° C. for 25 minutes. After the reaction, a solvent removal treatment was performed to obtain a block copolymer (A-1).

Synthetic example 2

[0081] Under nitrogen ambient gas, the cyclohexane solution containing 20 parts by weight of styrene, the n-butyllithium of 0.13 parts by weight, and the tetramethylethylenediamine of 0.05 parts by weight are placed in an autoclave with a stirrer , and carry out the polymerization reaction at a temperature of 70° C. for 20 minutes. Next, a cyclohexane solution containing 20 parts by weight of styrene and 30 parts by weight of 1,3-butadiene was added into the autoclave within 50 minutes, and a polymerization reaction was performed at 70° C. for 5 minutes. Next, a cyclohexane solution containing 15 parts by weight of 1,3-butadiene was further added, and polymerization reaction was performed at 70° C. for 5 minutes. Next, a cyclohexane solution containing 15 parts by weight of styrene was added, and the polymerization reaction was carried out at 70° C. for 25 minutes. After the reaction, a hydrogenation catalyst was added to the reaction solution containing the block copolymer pr...

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Abstract

A coating composition includes a block copolymer (A), an adhesive resin (B), and a solvent (C) for dispersing the block copolymer and the adhesive resin therein. The block copolymer contains at least two vinyl aromatic polymer blocks and at least one partially hydrogenated conjugated diene polymer block, and has a hydrogenation ratio ranging from 10% to 90%.

Description

technical field [0001] The present invention relates to a moisture-proof insulating film suitable for electronic components, in particular to a moisture-proof insulating film formed from a coating composition comprising a block copolymer, an adhesive resin and a solvent. Background technique [0002] With the advancement of science and technology, electronic components are gradually developing towards miniaturization and multi-function, and the circuit design of the electronic components is becoming more and more complicated. At this time, insulation and moisture resistance become important keys that affect the service life of electronic components. Accordingly, by forming a cladding layer outside the electronic component, protection functions such as moisture-proof, dust-proof, gas-blocking and insulation can be achieved. [0003] Japanese Patent Application Laid-Open No. 2005-132966 discloses an insulating coating, wherein the insulating coating is composed of methacrylic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D153/02C09D5/25H01B3/30H01B3/44
CPCH01B3/441H01B3/442B05D3/00C09D153/02
Inventor 李光洁林伯宣
Owner CHI MEI CORP