Additive for producing low-profile electrolytic copper foil and production process

A technology of electrolytic copper foil and additives, applied in electrolysis process, electroforming, etc., can solve the problems of increasing battery internal resistance, decrease of adhesion between paint and copper foil, paint peeling off, etc., and achieve the effect of low profile

Inactive Publication Date: 2013-03-27
惠州联合铜箔电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Lithium-ion battery anode carriers also have strict requirements on the profile of the anode surface of electrolytic copper foil. When the profile is too high, the peak-shaped anode surface will cause gaps between the negative electrode coating and the peaks and valleys, because the coating has certain particles. Generally, the shape of the peak and valley is in the shape of "V", so the negative electrode coating cannot reach the bottom of the peak and valley, forming a gap, thereby increasing the internal resistance of the battery; when the profile is too low and the anode surface is in a mirror shape, it will make The adhesion between the paint and the copper foil is greatly reduced, and the paint will not be applied during the paint process, or the paint will fall off after the paint is applied.

Method used

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  • Additive for producing low-profile electrolytic copper foil and production process
  • Additive for producing low-profile electrolytic copper foil and production process
  • Additive for producing low-profile electrolytic copper foil and production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 1. Additive formula: Additives are prepared according to the ratio of mass parts of MPS:PN:P:N:water=0.3:1:1.5:0.1:20, and the addition amount is 0.5ml / L electrolyte.

[0044] 2. Electrolyte process index: Cu=70~100g / L, H 2 SO 4 =80~110g / L, Cl - =30~60mg / L, temperature=50~60℃.

[0045] 3. Raw foil current density: 75A / dm 2 .

[0046] 4. Test results:

[0047] a.Physical properties

[0048]

[0049] b. Surface structure (3000X) such as figure 1 shown.

[0050] c. Result analysis: the physical properties of the copper foil meet the specified indicators, the Rz value of the anode surface is between 2 and 4 μm, the contour height is appropriate, the peak and valley depth is shallow and smooth, and there is no "V" shaped peak and valley structure of ordinary copper foil, which is The best structure of the present invention.

Embodiment 2

[0052] 1. Additive formula: Additives are formulated according to the mass ratio of MPS:PN:N:water=0.1:1:0.05:20, and the amount added is 0.5ml / L electrolyte.

[0053] 2. Electrolyte process index: Cu=70~100g / L, H 2 SO 4 =80~110g / L, Cl - =30~60mg / L, temperature=50~60℃.

[0054] 3. Raw foil current density: 75A / dm 2 .

[0055] 4. Test results:

[0056] a.Physical properties

[0057]

[0058] b. Surface structure (3000X) such as figure 2 shown.

[0059] c. Result analysis: Since there is no P (polyethylene glycol) in the additive, and the addition of MPS and N is small, small gaps appear on the anode surface of the copper foil, the surface profile is large, and the high temperature tensile strength and elongation are low.

Embodiment 3

[0061] 1. Additive formula: Additives are prepared according to the mass ratio of MPS:PN:P:N:water=0.3:1:1.5:0.05:20, and the addition amount is 0.5ml / L electrolyte.

[0062] 2. Electrolyte process index: Cu=70~100g / L, H 2 SO 4 =80~110g / L, Cl - =30~60mg / L, temperature=50~60℃.

[0063] 3. Raw foil current density: 75A / dm 2 .

[0064] 4. Test results:

[0065] a.Physical properties

[0066]

[0067] b. Surface structure (3000X) such as image 3 shown.

[0068] c. Result analysis: the addition of N is less, the profile of the anode surface is higher, and the Rz value is larger.

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Abstract

The invention relates to low-profile electrolytic copper foil, particularly relates to an additive for producing the low-profile electrolytic copper foil, and also relates to a production process. The additive for producing the low-profile electrolytic copper foil is mixed by the following components: 0.2-0.4 part of sodium 3-mercapto-1-propanesulfonate; 0.8-1.2 part of polyvinyl alkylimine or polyethyleneimine alkyl compounds; 1.0-2.0 parts of polyethylene glycol 8000; 0.08-0.12 part of N,N-diethyl thiourea; and 20 parts of pure water. Electrolytic copper foil produced by the additive and the production process of the invention can not only maintain a low profile tolerance and low impedance, but also maintain high peel strength, and also is suitable for the manufacture of interior and exterior lines.

Description

technical field [0001] The invention relates to a low-profile electrolytic copper foil, in particular to an additive used in the production of the low-profile electrolytic copper foil, and to a production process thereof. Background technique [0002] Various types of electrolytic copper foil have different requirements for the structure of the anode surface (commonly known as rough surface) of copper foil. In the production process, the structure of the anode surface of copper foil is mainly controlled by additives. By adjusting the formula or ratio of additives, Copper foils with different crystallization methods and matte structures can be obtained by supporting the production with appropriate production processes. [0003] The profile of the anode surface of high-grade electrolytic copper foil for CCL and PCB has strict requirements. The Rz value is generally required to be 3-5 μm, which is more suitable, and a high anti-peeling strength must be ensured. If it is produce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D3/38C25D1/04
Inventor 周启伦黄国平万新领郑惠军朱各桂高元亨邓烨
Owner 惠州联合铜箔电子材料有限公司
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