Determination method of silicon dioxide, silicon and silicon carbide in waste mortar from silicon wafer cutting
A silicon dioxide and silicon wafer cutting technology, which is applied in the measurement of color/spectral characteristics, weighing by removing certain components, etc., can solve the problems of high operation requirements, expensive platinum crucible, and inability to meet the requirements of silicon dioxide determination.
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[0033] 1. Main instrument and equipment used in the present invention:
[0034] 1. Model 1752 UV-Vis spectrophotometer;
[0035] 1.2 constant temperature water bath;
[0036] 1.3 Vacuum drying oven.
[0037] 2. The drafting of reagent used in the present invention and standard curve:
[0038] 2.1 Potassium chloride solution (10%)
[0039] 2.2 Hydrochloric acid: add 1 volume of hydrochloric acid to 1 volume of water
[0040] 2.3 Hydrofluoric acid: add 1 volume of hydrofluoric acid to 1 volume of water
[0041] 2.4 Aluminum chloride solution (45%): Dissolve 45g of aluminum chloride (hexahydrate) in water and dilute to 200mL
[0042] 2.5 p-nitrophenol solution (0.2%)
[0043] 2.6 Ammonia: Add 1 volume of ammonia to 4 volumes of water
[0044] 2.7 Hydrochloric acid: Add 1 volume of hydrochloric acid to 4 volumes of water
[0045] 2.8 Ammonium molybdate solution (8%): Dissolve 8g ammonium molybdate in water (stir and heat slightly), dilute to 100mL
[0046] 2.9 Tartaric ac...
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Abstract
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