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Silicon-based germanium epitaxial structure and preparation method thereof

A near-infrared, detector technology, used in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., to achieve high quality and improve quality

Active Publication Date: 2015-06-17
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
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Problems solved by technology

[0006] In view of the above existing problems and deficiencies, the purpose of the present invention is to provide a waveguide near-infrared detector based on silicon-based germanium epitaxy and its preparation method, so as to solve the photonic bandgap effect of two-dimensional photonic crystals in existing near-infrared detectors. application, and the release of stress caused by lattice mismatch between Ge and Si

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  • Silicon-based germanium epitaxial structure and preparation method thereof
  • Silicon-based germanium epitaxial structure and preparation method thereof
  • Silicon-based germanium epitaxial structure and preparation method thereof

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[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0020] The present invention is mainly to solve key problems such as difficulty in making a 1.6 μm detector due to the limitation of the critical thickness and quantum confinement effect of existing Si / Ge detectors, and provides a kind of photon-based epitaxial film capable of significantly improving the quality of Ge-based epitaxial films. A near-infrared detector with a crystal structure and a preparation method thereof, wherein the structural parameters of the photonic crystal can be adjusted independently, and can be applied to various types of substrate materials and corresponding wave bands.

[0021] like figure 1 as shown, figure 1 A schematic structural view of a waveguide near-infrared detector based on silicon-...

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Abstract

The invention discloses a waveguide near-infrared detector based on silicon-based germanium epitaxy and a method for preparing the waveguide near-infrared detector. The waveguide near-infrared detector comprises an n-type Si substrate, a Ge / Si buffer layer formed on the n-type Si substrate, an air porous or dielectric column type photonic crystal prepared in an SiO2 layer deposited on the Ge / Si buffer layer, a Ge-based epitaxial film formed on the photonic crystal, an n-type Si contact electrode Al, a P-type Si contact electrode and a passivation layer, wherein the n-type Si contact electrode Al is prepared on a step which is formed by etching the outer side of the Ge-based epitaxial film until the interior of the Ge / Si buffer layer; the P-type Si contact electrode is prepared at the center of the upper surface of the Ge-based epitaxial film; and the passivation layer is formed on the etched Ge-based epitaxial film. The problems of stress release caused by Ge and Si lattice mismatch, application of photonic band gap effects of two-dimensional photonic crystals in existing near-infrared detectors, and the like are solved.

Description

technical field [0001] The invention belongs to the field of semiconductor integration technology, and mainly relates to the substrate structure design of a near-infrared detector based on silicon-based germanium epitaxy. Technology, especially a waveguide near-infrared detector based on silicon-based germanium epitaxy and its preparation method. Background technique [0002] With the wide application and in-depth study of modern information technology, optoelectronic integration technology represented by optical fiber communication and optical interconnection has put forward more and more urgent requirements for semiconductor optoelectronic devices and circuits. Manufacture of photodetectors with response wavelengths of 1.3 μm and 1.55 μm, high rate, high quantum efficiency and low dark current, and the realization of optoelectronic integrated receiver chips have always been the goals pursued by people. [0003] Although the process of photodetectors made of III-V material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/101H01L31/0352H01L31/18
CPCY02P70/50
Inventor 刘洪刚郭浩陈洪钧张雄常虎东薛百清韩乐王盛凯
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI