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Assembled power module

A power module and assembled technology, which is applied in the direction of output power conversion devices, fixed connections, electrical components, etc., can solve problems such as excessive deformation of terminals, reduce thermal stress and mechanical stress, improve service life, and facilitate installation Effect

Active Publication Date: 2015-06-10
MACMIC SCIENCE & TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an assembled power module with reasonable structure, convenient installation, which can solve the failure caused by excessive deformation of each terminal, and is easy to maintain.

Method used

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Embodiment Construction

[0013] see Figure 1~5 As shown, the assembled power module of the present invention includes a housing 2, a main circuit board 5, and a drive circuit board 1. The metal-clad ceramic substrate 51 on the main circuit board 5 is connected to various devices and a plurality of terminals 4, and is connected to the metal-clad Semiconductor chips, capacitors, resistors, diodes and other devices on the ceramic substrate 51 can form a half-bridge circuit or a three-phase bridge circuit, and can achieve protection functions such as overvoltage, undervoltage, overcurrent, and overheating. Semiconductor chips, capacitors, resistors, and diodes And the terminals 4 are soldered on the metal-clad ceramic substrate 51 to realize circuit connection. The terminals 4 of the present invention are electrode terminals and signal terminals. The printed circuit board on the driving circuit board 1 is soldered with resistors, capacitors, diodes, integrated circuits, etc., Realize the drive of the exter...

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Abstract

The invention relates to an assembled power module. A metal-coated ceramic substrate on a main circuit board is connected with devices and a plurality of terminals. Each terminal comprises a connecting part, a main part, a bent part and wing parts. A clamping plate with T-shaped slots is disposed above a cover plate of a case. The terminals penetrate through corresponding terminal holes on the cover plate and the corresponding T-shaped slots on the clamping plate. The main part of each terminal is located in a small-diameter hole of the T-shaped slot. The wing parts of each terminal are located on the upper end face or upper and lower end faces of the clamping plate. A drive circuit board is supported at the top of the case. The connecting parts of the terminals are elastically connected into respective mounting holes on the drive circuit board in an expanded manner. Elastic clamping plates protruding from two sides of the case are disposed in positioning holes on the drive circuit board, and the top of each elastic clamping plate is locked at the top of the drive circuit board. The assembled power module is reasonable in structure, avoids failure of the terminals caused by excessive deformation in mounting, and is convenient to maintain.

Description

Technical field [0001] The invention relates to an assembled power module, which belongs to the technical field of power module manufacturing. Background technique [0002] The power semiconducting module is used in inverter welding machines, various switching power supply controllers and electric vehicle controllers, etc. Its main function is to convert the input direct current into three-phase alternating current output. The power semiconductor module is a three-phase circuit composed of one or more drive units and one or more power modules. Traditional power semiconductor modules mainly include resistors, capacitors, diodes, semiconductor chips and other devices, as well as multiple electrode terminals and multiple signal terminals. Each device and multiple terminals are welded on a metal-clad ceramic substrate to form a main circuit board. The main circuit board is The glue seal is fixed on the shell. In order to reduce the volume of the power module, the drive circuit boar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/00H01R12/58
Inventor 张银
Owner MACMIC SCIENCE & TECHNOLOGY CO LTD
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