igbt device and method of making the same

Abstract

The invention discloses a manufacture process method for an insulated gate bipolar transistor (IGBT). Double-sided N type impurity diffusion is carried out on an N base zone to form a double-sided N type mixed zone which comprises a front N type mixed zone and a back N type mixed zone. The front N type mixed zone is thinned, and the remained front N type zone serves as a carrier storage layer. The back N type mixed zone is thinned, and the remained back N type zone serves as an N type buffer layer. Thus, a front carrier storage layer is formed to improve a safe working zone of the device. Simultaneously, the deep N type buffer layer is formed at the back to furthest optimize voltage resistance and drop voltage of a device. The invention simultaneously discloses a device manufactured with the method.

Description

technical field [0001] The invention relates to a manufacturing process method of a semiconductor integrated circuit, in particular to a manufacturing process method of an IGBT device; the invention also relates to a device manufactured by the method. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor), based on the power field effect transistor (VDMOS), adds a thin layer of P+ under the drift region (N-layer of N-type IGBT) that withstands high voltage, and introduces a conductive The modulation effect greatly improves the current handling capability of the device, but at the same time, the introduction of the P+ thin layer makes the IGBT have one more PNP transistor than the power field effect transistor, which is easy to cause latch-up and reduce the safe operating area. For this reason, a carrier storage layer (CS layer) is added under the p-well region (P-well), which improves the anti-latch-up capability of the IGBT. The general technique to realize...

AI Technical Summary

Problems solved by technology

[0003] For non-penetrating (NPT) IGBTs, in order to achieve high withstand voltage requirements, a thicker N-type base (N base) is required, which increases the conduction voltage drop at the same time, which is not conducive to the use of devices

In order to solve this contradiction, an N-type buffer layer (N buffer) is added between the back P+ collector layer and the N-type base area. Tube annealing is formed, but this technology has three deficiencies. One is that a high-energy ion implanter is required, and the equipment is expensive; the other is that the implantation depth cannot reach more than 2 microns, and the effect of the N-type buffer layer is weakened; The temperature limit behind the metal, the activation efficiency of the N-type buffer layer is not high, which has a certain impact on the device performance

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