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Heat conduction adhesive and preparation method of adhesive tape employing same

A technology of adhesives and thermally conductive adhesives, applied in the direction of adhesive additives, adhesives, non-polymer adhesive additives, etc., can solve the problems of low thermal conductivity, high price, and reduced adhesive properties of adhesives, and achieve thermal conductivity High, low production cost, the effect of improving adhesion

Active Publication Date: 2015-01-07
NINGBO SOKEN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] Among them, the thermal conductivity of acrylate adhesives is low, generally 0.15-0.20W / M.K, so it is necessary to add a large amount of inorganic heat-conducting agent with high thermal conductivity
In the above formula (1), it can be seen that with the increase of the filling amount of the inorganic heat conducting agent with high thermal conductivity, the thermal conductivity of the heat conductor will also increase. However, the price of the inorganic heat conducting agent with high thermal conductivity is high. If a large amount of inorganic heat conducting agent is filled, The price of its products will be greatly increased and the adhesive properties of the adhesive will be reduced accordingly

Method used

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  • Heat conduction adhesive and preparation method of adhesive tape employing same
  • Heat conduction adhesive and preparation method of adhesive tape employing same
  • Heat conduction adhesive and preparation method of adhesive tape employing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 1. Configuration of organometallic copper complex solution: Take 8 parts of copper phthalocyanine complex powder and add it to 92 parts of butanone MEK solvent, stir well until it is completely dissolved, and the solid content is 8%.

[0039] 2. The configuration of the adhesive mixture: Take 100 parts of acrylate adhesive (solid content 45%), add 14.07 parts of copper phthalocyanine complex solution, stir well and add 1.5 parts of isocyanate crosslinking agent II Methylene diisocyanate (XDI) (solid content 45%), and continue to stir until uniform.

[0040] 3. Adhesive coating: apply the above adhesive mixture on the release paper with high release force, the thickness of the coating is 40 μm, dry in an oven at 80°C for 2 minutes, and use soft aluminum foil or upper release force Laminated with release paper, matured in an oven at 40°C for 3 days, and then cut into adhesive tapes.

Embodiment 2

[0042] 1. Configuration of organometallic copper complex solution: Take 8 parts of copper phthalocyanine complex powder and add it to 92 parts of butanone MEK solvent, stir well until it is completely dissolved, and the solid content is 8%.

[0043]2. The configuration of the adhesive mixture: Take 100 parts of acrylate adhesive (solid content 45%), add 28.12 parts of copper phthalocyanine complex solution, stir well and add 1.5 parts of isocyanate crosslinking agent II Methylene diisocyanate (XDI) (solid content 45%), and continue to stir until uniform.

[0044] 3. Adhesive coating: apply the above adhesive mixture on the release paper with high release force, the thickness of the coating is 40 μm, dry in an oven at 80°C for 2 minutes, and use soft aluminum foil or upper release force Laminated with release paper, matured in an oven at 40°C for 3 days, and then cut into adhesive tapes.

Embodiment 3

[0046] 1. Configuration of organometallic copper complex solution: Take 8 parts of copper phthalocyanine complex powder and add it to 92 parts of butanone MEK solvent, stir well until it is completely dissolved, and the solid content is 8%.

[0047] 2. The configuration of the adhesive mixture: take 100 parts of acrylate adhesive (solid content 45%), add 56.25 parts of copper phthalocyanine complex solution, stir well and add 1.5 parts of isocyanate crosslinking agent II Methylene diisocyanate (XDI) (solid content 45%), and continue to stir until uniform.

[0048] 3. Adhesive coating: apply the above adhesive mixture on the release paper with high release force, the thickness of the coating is 40 μm, dry in an oven at 80°C for 2 minutes, and use soft aluminum foil or upper release force Laminated with release paper, matured in an oven at 40°C for 3 days, and then cut into adhesive tapes.

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Abstract

The invention discloses a heat conduction adhesive and a preparation method of an adhesive tape employing the same. The heat conduction adhesive comprises following raw materials in part by weight: 100 parts of acrylic ester adhesive, 1.0 to 5.0 parts of isocyanate bridging agent, 2.5 to 12.5 parts of soluble organic metal complex, and 0 to 200 parts of inorganic heat conduction agent. The preparation method of the adhesive tape is that prepared adhesive mixed liquor is coated on release paper with big release force, with the coating thickness of 30 to 50 micrometers, is dried for 1 to 3 minutes through a drying oven with the temperature of 80 DEG C, is compounded with release paper with small release force through soft aluminum foil, is ripened for 2 to 4 days in a drying oven with the temperature of 40 DEG C, and then is parted off to form the adhesive tape. The heat conduction adhesive and the adhesive tape have high adhesive property and high-thermal conductivity, and are particularly suitable for heat dissipation of various electronic components.

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a heat-conducting adhesive and a method for preparing a tape applied with the heat-conducting adhesive. Background technique [0002] In recent years, digital products have rapidly developed into lightness, thinness, and miniaturization, and these changes are inseparable from the high-performance miniaturization and high-density packaging technology of digital products [0003] Therefore, how to effectively dissipate heat from small circuit components has become the most important factor affecting the quality stability and long life of such products. In addition, with the rapid popularization of energy-saving and long-life LEDs in lighting, display and other fields, the luminous efficiency of LEDs has also been significantly improved. As the luminous efficiency of LEDs increases, the heat generation density of the LED light-emitting part also increases. Therefore, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/04C09J11/06C09J11/04C09J175/04C09J7/02
Inventor 柳彬彬徐苗森付明霞小林晃司
Owner NINGBO SOKEN CHEM
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