Miniature soldering lapped joint and lapping method

Abstract

The invention belongs to the technical field of material connection, and relates to a miniature soldering lapped joint and a lapping method. Two dog bone shaped thin copper substrates are lapped together by means of soldering, one slender end of each copper substrate serves as a neck while the other end thereof serves as a tail, the center of each tail is punched, the thickness of each copper substrate is 0.2-0.6mm, the width of each neck is 0.5-1mm, the width of each tail is 3-5mm, tail punch position is on a center line of each copper substrate and can be 2-5mm away from the corresponding tail, and diameter of punched holes is kept within the range of 0.8-2.5mm. The lapping method includes: firstly, placing one copper substrate in a paste brushing die; secondly, covering a screen on the paste brushing die for mesh alignment; and thirdly, coating soldering paste in meshes, taking away the screen, taking out the copper substrate, taking another copper substrate uncoated with the soldering paste for lapping and then placing the lapped copper substrate in a reflow furnace for soldering. By the method, size of soldered joints can be guaranteed, and one-step forming quantity is large.

Description

technical field [0001] The invention relates to a new miniature brazed lap joint and a lap joint method, which belong to the technical field of material connection, are suitable for preparing miniature brazed lap joints, and are applied to the reliability research of mechanics, heat and electricity of microelectronic connections . The process can effectively control the size of the solder joint, the width of the weld seam and the welding quality, and realize the convenience and mass production of the brazed lap joint. Background technique [0002] Microelectronic connections play a dual role of mechanical connection and electrical connection in electronic products. The reliability of connection joints determines the service life of electronic products. Therefore, the research on the reliability of microelectronic connections in mechanics, heat and electricity has always attracted much attention. Especially since the European Union formally approved the WEEE and RoSH directi...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned welded joints that are complicated to make, poor in quality uniformity, and cannot be produced in batches, and at the same time control the size of the solder joints and the width of the weld, and ensure the consistency of the quality of the welded joints. , thermal and electrical aspects of reliability testing requirements

Images