Metal oxide semiconductor field effect transistor (MOSFET) with lifted silicide source drain contact and manufacture method thereof
A manufacturing method and a technology of source-drain contact, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of reducing the total resistance of the device, failing to effectively reduce the interconnection resistance, and affecting the electrical performance of semiconductor devices. The effect of reducing interconnection resistance, reducing dosage, and improving electrical performance
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[0029] The features and technical effects of the technical solutions of the present invention are described in detail below with reference to the accompanying drawings and schematic embodiments, and a semiconductor device and a manufacturing method thereof that can effectively reduce interconnect resistance are disclosed. It should be noted that similar reference numerals denote similar structures, and the terms "first", "second", "upper", "lower", etc. used in this application may be used to modify various device structures or fabrication processes . These modifications do not imply a spatial, sequential, or hierarchical relationship of the modified device structures or fabrication processes unless otherwise specified.
[0030] First, refer to image 3 , forming contact holes in the base structure.
[0031] Specifically, the substrate 10 is provided first. The substrate 10 may be bulk silicon, silicon-on-insulator (SOI), or a compound semiconductor substrate such as SiGe, ...
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