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Crystalline epoxy resin

An epoxy resin and crystalline technology, which is applied in the direction of electrical components, circuits, semiconductor/solid device components, etc., can solve the problems of low melt viscosity and failure to achieve it, and achieve low viscosity, easy operation, and low hygroscopicity.

Active Publication Date: 2015-08-12
新亚 T&C
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxidation (epoxidation) of tetramethylbiphenol has not reached the required level, so it is urgent to develop epoxy resins with low melt viscosity and good fluidity.

Method used

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  • Crystalline epoxy resin
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Add an 8:2 mixture of tetramethyl biphenol and 2,6-dimethyl-1,4-benzenediol to the reactor (weight ratio) 1 mole, after 5.0 moles of excess epichlorohydrin (Hanwha General Chemical Co., Ltd.) was dissolved at room temperature, a normal pressure atmosphere was created at a temperature of 70° C., and sodium hydroxide (NaOH) catalyst was used for about 5 hours of epoxidation. After the reaction, eliminate epichlorohydrin, use 2.5 moles of toluene to dissolve the residue, use water to eliminate salt, after neutralization and water washing process, create a reduced pressure atmosphere at a temperature of 170 ° C, and recover the solvent to obtain an epoxy equivalent of 198.5 g / eq Level yellow crystalline epoxy resin. figure 1 is about the IR spectrum of the resin manufactured according to Example 1, figure 2 is the result of GPC analysis.

[0054] (FT-IR results: Epoxy group: 3030㎝-1, 1187㎝-1, 910㎝-1, C-CH3: 2916㎝-1, CH3: 1417㎝-1, O-CH2: 1462㎝-1)

Embodiment 2

[0056] Add a 7:3 mixture of tetramethyl biphenol and 2,6-dimethyl-1,4-benzenediol to the reactor (weight ratio) 1 mole, 5.0 moles of epichlorohydrin (Hanwha General Chemical Co., Ltd.) are dissolved at room temperature, and the temperature is 70°C to create a normal pressure atmosphere, and use a sodium hydroxide (NaOH) catalyst for about 5 hours. epoxidation reaction. After the reaction, eliminate epichlorohydrin, use 2.5 moles of toluene to dissolve the residue, use water to eliminate salt, and after neutralization and water washing, create a reduced-pressure atmosphere at a temperature of 170°C and recover the solvent to obtain an epoxy equivalent of 209.6g / eq Level yellow crystalline epoxy resin.

[0057] (FT-IR results: Epoxy group: 3028㎝-1, 1182㎝-1, 904㎝-1, C-CH3: 2916㎝-1, CH3: 1421㎝-1, O-CH2: 1467㎝-1)

Embodiment 3

[0059] Add a 5:5 mixture of tetramethyl biphenol and 2,6-dimethyl-1,4-benzenediol to the reactor (weight ratio) 1 mole, 5.0 moles of epichlorohydrin (Hanwha General Chemical Co., Ltd.) are dissolved at room temperature, and the temperature is 70°C to create a normal pressure atmosphere, and use a sodium hydroxide (NaOH) catalyst for about 5 hours. epoxidation reaction. After the reaction, eliminate epichlorohydrin, use 2.5 moles of toluene to dissolve the residue, use water to eliminate salt, after neutralization and water washing process, create a reduced pressure atmosphere at a temperature of 170 ° C, and recover the solvent to obtain an epoxy equivalent of 214.0 g / eq Level yellow crystalline epoxy resin.

[0060] (FT-IR results: Epoxy group: 3022㎝-1, 1187㎝-1, 915㎝-1, C-CH3: 2936㎝-1, CH3: 1412㎝-1, O-CH2: 1466㎝-1)

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Abstract

An epoxy resin is provided to be easy to handle because of being crystallized at room temperature, and to manufacture a hardened material having excellent heat resistance, low viscosity at melting, and low moisture absorption thereby using for sealing material for electric and electronic components. CONSTITUTION: An epoxy resin is in chemical formula 1. In chemical formula 1, N is the integer of 1-50, M is the integer of 1-50, the bonding order of each unit structure according to N and M is able to be changeable randomly, and X are respectively and independently hydrogen or a C1-6 alkyl group. At least three or more of four X compositing one monomer in chemical formula 1 are C1-6 alkyl groups. N and M in chemical formula 1 satisfies relational equation: 5.67[Delta] M / N [Delta] 32.33.

Description

technical field [0001] The present invention relates to crystalline epoxy resins. More specifically, the present invention relates to epoxy resins with low melt viscosity, good reactivity, good heat resistance and moisture resistance of hardened products, and crystallinity at room temperature. Background technique [0002] Epoxy resins have been widely used industrially, and recently the functions required for them have been increasingly advanced. For example, the representative field of resin compositions with epoxy resin as the main agent is semiconductor packaging materials. Recently, with the improvement of the integration level of semiconductor components, the packaging size has become larger and thinner, and the mounting method has gradually migrated to surface mount. Therefore, it is necessary to develop materials with better solder heat resistance. [0003] On the other hand, in the process of encapsulating a semiconductor device with an encapsulating material, crac...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/06C08L63/00
CPCC08G59/22C08G59/245C08L63/00C08L2201/02H01L23/29
Inventor 朴龙义洪晟镐李贵恒
Owner 新亚 T&C